Copper Removal from Electroplating Wastewater by Coprecipitation of Copper-Based Supramolecular Materials: Preparation and Application Study
This paper describes an experimental study for the removal of copper ions from electroplating wastewater. Different metal ions are added to the wastewater to remove copper ions by coprecipitation and the copper-based supramolecular materials with layered structures are obtained. It is found that the...
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Main Authors: | De-Kui Bai, Quan-Hong Ying, Ni Wang, Jin-Hui Lin |
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Format: | Article |
Language: | English |
Published: |
Wiley
2016-01-01
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Series: | Journal of Chemistry |
Online Access: | http://dx.doi.org/10.1155/2016/5281561 |
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