Bai, D., Ying, Q., Wang, N., & Lin, J. Copper Removal from Electroplating Wastewater by Coprecipitation of Copper-Based Supramolecular Materials: Preparation and Application Study. Wiley.
Chicago Style (17th ed.) CitationBai, De-Kui, Quan-Hong Ying, Ni Wang, and Jin-Hui Lin. Copper Removal from Electroplating Wastewater by Coprecipitation of Copper-Based Supramolecular Materials: Preparation and Application Study. Wiley.
MLA (9th ed.) CitationBai, De-Kui, et al. Copper Removal from Electroplating Wastewater by Coprecipitation of Copper-Based Supramolecular Materials: Preparation and Application Study. Wiley.
Warning: These citations may not always be 100% accurate.