Thermal Heating in ReRAM Crossbar Arrays: Challenges and Solutions
The high speed, scalability, and parallelism offered by ReRAM crossbar arrays foster the development of ReRAM-based next-generation AI accelerators. At the same time, the sensitivity of ReRAM to temperature variations decreases <inline-formula> <tex-math notation="LaTeX">$\text...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2024-01-01
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| Series: | IEEE Open Journal of Circuits and Systems |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10416883/ |
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