Thermal Heating in ReRAM Crossbar Arrays: Challenges and Solutions
The high speed, scalability, and parallelism offered by ReRAM crossbar arrays foster the development of ReRAM-based next-generation AI accelerators. At the same time, the sensitivity of ReRAM to temperature variations decreases <inline-formula> <tex-math notation="LaTeX">$\text...
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| Format: | Article |
| Language: | English |
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IEEE
2024-01-01
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| Series: | IEEE Open Journal of Circuits and Systems |
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| Online Access: | https://ieeexplore.ieee.org/document/10416883/ |
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| author | Kamilya Smagulova Mohammed E. Fouda Ahmed Eltawil |
| author_facet | Kamilya Smagulova Mohammed E. Fouda Ahmed Eltawil |
| author_sort | Kamilya Smagulova |
| collection | DOAJ |
| description | The high speed, scalability, and parallelism offered by ReRAM crossbar arrays foster the development of ReRAM-based next-generation AI accelerators. At the same time, the sensitivity of ReRAM to temperature variations decreases <inline-formula> <tex-math notation="LaTeX">$\text{R}_{ON}/\text{R}_{OFF}$ </tex-math></inline-formula> ratio and negatively affects the achieved accuracy and reliability of the hardware. Various works on temperature-aware optimization and remapping in ReRAM crossbar arrays reported up to 58% improvement in accuracy and <inline-formula> <tex-math notation="LaTeX">$2.39\times $ </tex-math></inline-formula> ReRAM lifetime enhancement. This paper classifies the challenges caused by thermal heat, starting from constraints in ReRAM cells’ dimensions and characteristics to their placement in the architecture. In addition, it reviews the available solutions designed to mitigate the impact of these challenges, including emerging temperature-resilient Deep Neural Network (DNN) training methods. Our work also provides a summary of the techniques and their advantages and limitations. |
| format | Article |
| id | doaj-art-6ea17a54a9144fa488be82ce4e165a81 |
| institution | Kabale University |
| issn | 2644-1225 |
| language | English |
| publishDate | 2024-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Open Journal of Circuits and Systems |
| spelling | doaj-art-6ea17a54a9144fa488be82ce4e165a812025-01-21T00:02:45ZengIEEEIEEE Open Journal of Circuits and Systems2644-12252024-01-015284110.1109/OJCAS.2024.336025710416883Thermal Heating in ReRAM Crossbar Arrays: Challenges and SolutionsKamilya Smagulova0Mohammed E. Fouda1https://orcid.org/0000-0001-7139-3428Ahmed Eltawil2https://orcid.org/0000-0003-1849-083XDivision of CEMSE, King Abdullah University of Science and Technology, Thuwal, Saudi ArabiaRain Neuromorphics, Inc., San Francisco, CA, USADivision of CEMSE, King Abdullah University of Science and Technology, Thuwal, Saudi ArabiaThe high speed, scalability, and parallelism offered by ReRAM crossbar arrays foster the development of ReRAM-based next-generation AI accelerators. At the same time, the sensitivity of ReRAM to temperature variations decreases <inline-formula> <tex-math notation="LaTeX">$\text{R}_{ON}/\text{R}_{OFF}$ </tex-math></inline-formula> ratio and negatively affects the achieved accuracy and reliability of the hardware. Various works on temperature-aware optimization and remapping in ReRAM crossbar arrays reported up to 58% improvement in accuracy and <inline-formula> <tex-math notation="LaTeX">$2.39\times $ </tex-math></inline-formula> ReRAM lifetime enhancement. This paper classifies the challenges caused by thermal heat, starting from constraints in ReRAM cells’ dimensions and characteristics to their placement in the architecture. In addition, it reviews the available solutions designed to mitigate the impact of these challenges, including emerging temperature-resilient Deep Neural Network (DNN) training methods. Our work also provides a summary of the techniques and their advantages and limitations.https://ieeexplore.ieee.org/document/10416883/ReRAMmemristorthermal heatingnonidealityresistive crossbar arraysresistive hardware accelerators |
| spellingShingle | Kamilya Smagulova Mohammed E. Fouda Ahmed Eltawil Thermal Heating in ReRAM Crossbar Arrays: Challenges and Solutions IEEE Open Journal of Circuits and Systems ReRAM memristor thermal heating nonideality resistive crossbar arrays resistive hardware accelerators |
| title | Thermal Heating in ReRAM Crossbar Arrays: Challenges and Solutions |
| title_full | Thermal Heating in ReRAM Crossbar Arrays: Challenges and Solutions |
| title_fullStr | Thermal Heating in ReRAM Crossbar Arrays: Challenges and Solutions |
| title_full_unstemmed | Thermal Heating in ReRAM Crossbar Arrays: Challenges and Solutions |
| title_short | Thermal Heating in ReRAM Crossbar Arrays: Challenges and Solutions |
| title_sort | thermal heating in reram crossbar arrays challenges and solutions |
| topic | ReRAM memristor thermal heating nonideality resistive crossbar arrays resistive hardware accelerators |
| url | https://ieeexplore.ieee.org/document/10416883/ |
| work_keys_str_mv | AT kamilyasmagulova thermalheatinginreramcrossbararrayschallengesandsolutions AT mohammedefouda thermalheatinginreramcrossbararrayschallengesandsolutions AT ahmedeltawil thermalheatinginreramcrossbararrayschallengesandsolutions |