APA (7th ed.) Citation

Wang, Y., Li, X., Lou, W., Deng, L., & Fan, Y. Curing Dynamics of Soy Flour-Based Adhesives Enhanced by Waterborne Polyurethane. Wiley.

Chicago Style (17th ed.) Citation

Wang, Yong, Xianjun Li, Wanli Lou, Layun Deng, and Youhua Fan. Curing Dynamics of Soy Flour-Based Adhesives Enhanced by Waterborne Polyurethane. Wiley.

MLA (9th ed.) Citation

Wang, Yong, et al. Curing Dynamics of Soy Flour-Based Adhesives Enhanced by Waterborne Polyurethane. Wiley.