Analyzing Thermal Module Developments and Trends in High-Power LED
The solid-state light emitting diode (SSLED) has been verified as consumer-electronic products and attracts attention to indoor and outdoor lighting lamp, which has a great benefit in saving energy and environmental protection. However, LED junction temperature will influence the luminous efficiency...
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| Format: | Article |
| Language: | English |
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Wiley
2014-01-01
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| Series: | International Journal of Photoenergy |
| Online Access: | http://dx.doi.org/10.1155/2014/120452 |
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| author | Jung-Chang Wang |
| author_facet | Jung-Chang Wang |
| author_sort | Jung-Chang Wang |
| collection | DOAJ |
| description | The solid-state light emitting diode (SSLED) has been verified as consumer-electronic products and attracts attention to indoor and outdoor lighting lamp, which has a great benefit in saving energy and environmental protection. However, LED junction temperature will influence the luminous efficiency, spectral color, life cycle, and stability. This study utilizes thermal performance experiments with the illumination-analysis method and window program (vapour chamber thermal module, VCTM V1.0) to investigate and analyze the high-power LED (Hi-LED) lighting thermal module, in order to achieve the best solution of the fin parameters under the natural convection. The computing core of the VCTM program employs the theoretical thermal resistance analytical approach with iterative convergence stated in this study to obtain a numerical solution. Results showed that the best geometry of thermal module is 4.4 mm fin thickness, 9.4 mm fin pitch, and 37 mm fin height with the LED junction temperature of 58.8°C. And the experimental thermal resistances are in good agreement with the theoretical thermal resistances; calculating error between measured data and simulation results is no more than ±7%. Thus, the Hi-LED illumination lamp has high life cycle and reliability. |
| format | Article |
| id | doaj-art-6883cdc1eb8b42299117fcc69930708a |
| institution | Kabale University |
| issn | 1110-662X 1687-529X |
| language | English |
| publishDate | 2014-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | International Journal of Photoenergy |
| spelling | doaj-art-6883cdc1eb8b42299117fcc69930708a2025-02-03T01:20:22ZengWileyInternational Journal of Photoenergy1110-662X1687-529X2014-01-01201410.1155/2014/120452120452Analyzing Thermal Module Developments and Trends in High-Power LEDJung-Chang Wang0Department of Marine Engineering, National Taiwan Ocean University (NTOU), No. 2 Pei-Ning Road, Keelung 20224, TaiwanThe solid-state light emitting diode (SSLED) has been verified as consumer-electronic products and attracts attention to indoor and outdoor lighting lamp, which has a great benefit in saving energy and environmental protection. However, LED junction temperature will influence the luminous efficiency, spectral color, life cycle, and stability. This study utilizes thermal performance experiments with the illumination-analysis method and window program (vapour chamber thermal module, VCTM V1.0) to investigate and analyze the high-power LED (Hi-LED) lighting thermal module, in order to achieve the best solution of the fin parameters under the natural convection. The computing core of the VCTM program employs the theoretical thermal resistance analytical approach with iterative convergence stated in this study to obtain a numerical solution. Results showed that the best geometry of thermal module is 4.4 mm fin thickness, 9.4 mm fin pitch, and 37 mm fin height with the LED junction temperature of 58.8°C. And the experimental thermal resistances are in good agreement with the theoretical thermal resistances; calculating error between measured data and simulation results is no more than ±7%. Thus, the Hi-LED illumination lamp has high life cycle and reliability.http://dx.doi.org/10.1155/2014/120452 |
| spellingShingle | Jung-Chang Wang Analyzing Thermal Module Developments and Trends in High-Power LED International Journal of Photoenergy |
| title | Analyzing Thermal Module Developments and Trends in High-Power LED |
| title_full | Analyzing Thermal Module Developments and Trends in High-Power LED |
| title_fullStr | Analyzing Thermal Module Developments and Trends in High-Power LED |
| title_full_unstemmed | Analyzing Thermal Module Developments and Trends in High-Power LED |
| title_short | Analyzing Thermal Module Developments and Trends in High-Power LED |
| title_sort | analyzing thermal module developments and trends in high power led |
| url | http://dx.doi.org/10.1155/2014/120452 |
| work_keys_str_mv | AT jungchangwang analyzingthermalmoduledevelopmentsandtrendsinhighpowerled |