A Comparative Study between Via-Hole and Via-Free Grounded Coplanar Waveguide to Microstrip Transitions on Thin Polymer Substrate
A comparative study between via-holed and via-free back-to-back GCPW-MS-GCPW (Grounded Coplanar Waveguide-Microstrip lines) transitions is reported in this paper. According to simulation results, both via-holed and via-free transitions on commercial benzocyclobutene polymer 20 µm film show a bandwid...
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| Format: | Article |
| Language: | English |
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Wiley
2015-01-01
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| Series: | International Journal of Antennas and Propagation |
| Online Access: | http://dx.doi.org/10.1155/2015/481768 |
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| author | Mohammed El Gibari HongWu Li |
| author_facet | Mohammed El Gibari HongWu Li |
| author_sort | Mohammed El Gibari |
| collection | DOAJ |
| description | A comparative study between via-holed and via-free back-to-back GCPW-MS-GCPW (Grounded Coplanar Waveguide-Microstrip lines) transitions is reported in this paper. According to simulation results, both via-holed and via-free transitions on commercial benzocyclobutene polymer 20 µm film show a bandwidth over 57 GHz. Bandwidth of optimized via-holed transitions increases with the via-hole diameter, up to 75 GHz with 300 μm via-hole diameter. The via-hole free transition achieves experimentally an ultrabroadband from 2 GHz to 78 GHz with an insertion loss of only 0.5 dB thanks to the copper metallization thickness of 2 μm. In addition, these measurement results are in perfect agreement with the simulation results. These via-free and via-holes transitions are very useful and requested in component packaging, on-wafer measurements of microstrip based microwave integrated circuits, and also the interconnections in hybrid circuits including both microstrip and coplanar structures. |
| format | Article |
| id | doaj-art-652962a136cc45ca9617b8ee51523927 |
| institution | Kabale University |
| issn | 1687-5869 1687-5877 |
| language | English |
| publishDate | 2015-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | International Journal of Antennas and Propagation |
| spelling | doaj-art-652962a136cc45ca9617b8ee515239272025-02-03T05:46:10ZengWileyInternational Journal of Antennas and Propagation1687-58691687-58772015-01-01201510.1155/2015/481768481768A Comparative Study between Via-Hole and Via-Free Grounded Coplanar Waveguide to Microstrip Transitions on Thin Polymer SubstrateMohammed El Gibari0HongWu Li1IETR Site de Nantes, Université de Nantes Angers Le Mans (UNAM), UMR CNRS 6164, 2 rue de la Houssinière, BP 92208, 44322 Nantes Cedex 3, FranceIETR Site de Nantes, Université de Nantes Angers Le Mans (UNAM), UMR CNRS 6164, 2 rue de la Houssinière, BP 92208, 44322 Nantes Cedex 3, FranceA comparative study between via-holed and via-free back-to-back GCPW-MS-GCPW (Grounded Coplanar Waveguide-Microstrip lines) transitions is reported in this paper. According to simulation results, both via-holed and via-free transitions on commercial benzocyclobutene polymer 20 µm film show a bandwidth over 57 GHz. Bandwidth of optimized via-holed transitions increases with the via-hole diameter, up to 75 GHz with 300 μm via-hole diameter. The via-hole free transition achieves experimentally an ultrabroadband from 2 GHz to 78 GHz with an insertion loss of only 0.5 dB thanks to the copper metallization thickness of 2 μm. In addition, these measurement results are in perfect agreement with the simulation results. These via-free and via-holes transitions are very useful and requested in component packaging, on-wafer measurements of microstrip based microwave integrated circuits, and also the interconnections in hybrid circuits including both microstrip and coplanar structures.http://dx.doi.org/10.1155/2015/481768 |
| spellingShingle | Mohammed El Gibari HongWu Li A Comparative Study between Via-Hole and Via-Free Grounded Coplanar Waveguide to Microstrip Transitions on Thin Polymer Substrate International Journal of Antennas and Propagation |
| title | A Comparative Study between Via-Hole and Via-Free Grounded Coplanar Waveguide to Microstrip Transitions on Thin Polymer Substrate |
| title_full | A Comparative Study between Via-Hole and Via-Free Grounded Coplanar Waveguide to Microstrip Transitions on Thin Polymer Substrate |
| title_fullStr | A Comparative Study between Via-Hole and Via-Free Grounded Coplanar Waveguide to Microstrip Transitions on Thin Polymer Substrate |
| title_full_unstemmed | A Comparative Study between Via-Hole and Via-Free Grounded Coplanar Waveguide to Microstrip Transitions on Thin Polymer Substrate |
| title_short | A Comparative Study between Via-Hole and Via-Free Grounded Coplanar Waveguide to Microstrip Transitions on Thin Polymer Substrate |
| title_sort | comparative study between via hole and via free grounded coplanar waveguide to microstrip transitions on thin polymer substrate |
| url | http://dx.doi.org/10.1155/2015/481768 |
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