A Comparative Study between Via-Hole and Via-Free Grounded Coplanar Waveguide to Microstrip Transitions on Thin Polymer Substrate
A comparative study between via-holed and via-free back-to-back GCPW-MS-GCPW (Grounded Coplanar Waveguide-Microstrip lines) transitions is reported in this paper. According to simulation results, both via-holed and via-free transitions on commercial benzocyclobutene polymer 20 µm film show a bandwid...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2015-01-01
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| Series: | International Journal of Antennas and Propagation |
| Online Access: | http://dx.doi.org/10.1155/2015/481768 |
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| Summary: | A comparative study between via-holed and via-free back-to-back GCPW-MS-GCPW (Grounded Coplanar Waveguide-Microstrip lines) transitions is reported in this paper. According to simulation results, both via-holed and via-free transitions on commercial benzocyclobutene polymer 20 µm film show a bandwidth over 57 GHz. Bandwidth of optimized via-holed transitions increases with the via-hole diameter, up to 75 GHz with 300 μm via-hole diameter. The via-hole free transition achieves experimentally an ultrabroadband from 2 GHz to 78 GHz with an insertion loss of only 0.5 dB thanks to the copper metallization thickness of 2 μm. In addition, these measurement results are in perfect agreement with the simulation results. These via-free and via-holes transitions are very useful and requested in component packaging, on-wafer measurements of microstrip based microwave integrated circuits, and also the interconnections in hybrid circuits including both microstrip and coplanar structures. |
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| ISSN: | 1687-5869 1687-5877 |