3D laser structuring of supermetalphobic microstructures inside elastomer for multilayer high-density interconnect soft electronics
High-density interconnect (HDI) soft electronics that can integrate multiple individual functions into one miniaturized monolithic system is promising for applications related to smart healthcare, soft robotics, and human-machine interactions. However, despite the recent advances, the development of...
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| Format: | Article |
| Language: | English |
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IOP Publishing
2025-01-01
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| Series: | International Journal of Extreme Manufacturing |
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| Online Access: | https://doi.org/10.1088/2631-7990/ada835 |
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| author | Chengjun Zhang Qing Yang Haoyu Li Zexiang Luo Yu Lu Jialiang Zhang Cheng Li Feng Chen |
| author_facet | Chengjun Zhang Qing Yang Haoyu Li Zexiang Luo Yu Lu Jialiang Zhang Cheng Li Feng Chen |
| author_sort | Chengjun Zhang |
| collection | DOAJ |
| description | High-density interconnect (HDI) soft electronics that can integrate multiple individual functions into one miniaturized monolithic system is promising for applications related to smart healthcare, soft robotics, and human-machine interactions. However, despite the recent advances, the development of three-dimensional (3D) soft electronics with both high resolution and high integration is still challenging because of the lack of efficient manufacturing methods to guarantee interlayer alignment of the high-density vias and reliable interlayer electrical conductivity. Here, an advanced 3D laser printing pathway, based on femtosecond laser direct writing (FLDW), is demonstrated for preparing liquid metal (LM)-based any layer HDI soft electronics. FLDW technology, with the characteristics of high spatial resolution and high precision, allows the maskless fabrication of high-resolution embedded LM microchannels and high-density vertical interconnect accesses for 3D integrated circuits. High-aspect-ratio blind/through LM microstructures are formed inside the elastomer due to the supermetalphobicity induced during laser ablation. The LM-based HDI circuit featuring high resolution (∼1.5 μ m) and high integration (10-layer electrical interconnection) is achieved for customized soft electronics, including various customized multilayer passive electric components, soft multilayer circuit, and cross-scale multimode sensors. The 3D laser printing method provides a versatile approach for developing chip-level soft electronics. |
| format | Article |
| id | doaj-art-64814ac3ce2047ea91aff2a9fdc814cd |
| institution | Kabale University |
| issn | 2631-7990 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | IOP Publishing |
| record_format | Article |
| series | International Journal of Extreme Manufacturing |
| spelling | doaj-art-64814ac3ce2047ea91aff2a9fdc814cd2025-02-05T13:20:47ZengIOP PublishingInternational Journal of Extreme Manufacturing2631-79902025-01-017303500410.1088/2631-7990/ada8353D laser structuring of supermetalphobic microstructures inside elastomer for multilayer high-density interconnect soft electronicsChengjun Zhang0Qing Yang1Haoyu Li2Zexiang Luo3Yu Lu4Jialiang Zhang5Cheng Li6Feng Chen7https://orcid.org/0000-0002-7031-7404School of Instrument Science and Technology, Xi’an Jiaotong University , Xi’an 710049, People’s Republic of ChinaSchool of Instrument Science and Technology, Xi’an Jiaotong University , Xi’an 710049, People’s Republic of ChinaState Key Laboratory for Manufacturing System Engineering and Shaanxi Key Laboratory of Photonics Technology for Information, School of Electronic Science and Engineering, Xi’an Jiaotong University , Xi’an 710049, People’s Republic of ChinaState Key Laboratory for Manufacturing System Engineering and Shaanxi Key Laboratory of Photonics Technology for Information, School of Electronic Science and Engineering, Xi’an Jiaotong University , Xi’an 710049, People’s Republic of ChinaState Key Laboratory for Manufacturing System Engineering and Shaanxi Key Laboratory of Photonics Technology for Information, School of Electronic Science and Engineering, Xi’an Jiaotong University , Xi’an 710049, People’s Republic of ChinaState Key Laboratory for Manufacturing System Engineering and Shaanxi Key Laboratory of Photonics Technology for Information, School of Electronic Science and Engineering, Xi’an Jiaotong University , Xi’an 710049, People’s Republic of ChinaState Key Laboratory for Manufacturing System Engineering and Shaanxi Key Laboratory of Photonics Technology for Information, School of Electronic Science and Engineering, Xi’an Jiaotong University , Xi’an 710049, People’s Republic of ChinaState Key Laboratory for Manufacturing System Engineering and Shaanxi Key Laboratory of Photonics Technology for Information, School of Electronic Science and Engineering, Xi’an Jiaotong University , Xi’an 710049, People’s Republic of ChinaHigh-density interconnect (HDI) soft electronics that can integrate multiple individual functions into one miniaturized monolithic system is promising for applications related to smart healthcare, soft robotics, and human-machine interactions. However, despite the recent advances, the development of three-dimensional (3D) soft electronics with both high resolution and high integration is still challenging because of the lack of efficient manufacturing methods to guarantee interlayer alignment of the high-density vias and reliable interlayer electrical conductivity. Here, an advanced 3D laser printing pathway, based on femtosecond laser direct writing (FLDW), is demonstrated for preparing liquid metal (LM)-based any layer HDI soft electronics. FLDW technology, with the characteristics of high spatial resolution and high precision, allows the maskless fabrication of high-resolution embedded LM microchannels and high-density vertical interconnect accesses for 3D integrated circuits. High-aspect-ratio blind/through LM microstructures are formed inside the elastomer due to the supermetalphobicity induced during laser ablation. The LM-based HDI circuit featuring high resolution (∼1.5 μ m) and high integration (10-layer electrical interconnection) is achieved for customized soft electronics, including various customized multilayer passive electric components, soft multilayer circuit, and cross-scale multimode sensors. The 3D laser printing method provides a versatile approach for developing chip-level soft electronics.https://doi.org/10.1088/2631-7990/ada8353D soft electronicsliquid metalhigh-density interconnectionfemtosecond laser direct writingsupermetalphobicity |
| spellingShingle | Chengjun Zhang Qing Yang Haoyu Li Zexiang Luo Yu Lu Jialiang Zhang Cheng Li Feng Chen 3D laser structuring of supermetalphobic microstructures inside elastomer for multilayer high-density interconnect soft electronics International Journal of Extreme Manufacturing 3D soft electronics liquid metal high-density interconnection femtosecond laser direct writing supermetalphobicity |
| title | 3D laser structuring of supermetalphobic microstructures inside elastomer for multilayer high-density interconnect soft electronics |
| title_full | 3D laser structuring of supermetalphobic microstructures inside elastomer for multilayer high-density interconnect soft electronics |
| title_fullStr | 3D laser structuring of supermetalphobic microstructures inside elastomer for multilayer high-density interconnect soft electronics |
| title_full_unstemmed | 3D laser structuring of supermetalphobic microstructures inside elastomer for multilayer high-density interconnect soft electronics |
| title_short | 3D laser structuring of supermetalphobic microstructures inside elastomer for multilayer high-density interconnect soft electronics |
| title_sort | 3d laser structuring of supermetalphobic microstructures inside elastomer for multilayer high density interconnect soft electronics |
| topic | 3D soft electronics liquid metal high-density interconnection femtosecond laser direct writing supermetalphobicity |
| url | https://doi.org/10.1088/2631-7990/ada835 |
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