APA (7th ed.) Citation

Zhang, C., Yang, Q., Li, H., Luo, Z., Lu, Y., Zhang, J., . . . Chen, F. 3D laser structuring of supermetalphobic microstructures inside elastomer for multilayer high-density interconnect soft electronics. IOP Publishing.

Chicago Style (17th ed.) Citation

Zhang, Chengjun, Qing Yang, Haoyu Li, Zexiang Luo, Yu Lu, Jialiang Zhang, Cheng Li, and Feng Chen. 3D Laser Structuring of Supermetalphobic Microstructures Inside Elastomer for Multilayer High-density Interconnect Soft Electronics. IOP Publishing.

MLA (9th ed.) Citation

Zhang, Chengjun, et al. 3D Laser Structuring of Supermetalphobic Microstructures Inside Elastomer for Multilayer High-density Interconnect Soft Electronics. IOP Publishing.