A 3D DC Electric Field Meter Based on Sensor Chips Packaged Using a Highly Sensitive Scheme
This study presents a 3D DC electric field meter (EFM) that uses three identical 1D MEMS chips. The shielding electrodes and sensing electrodes of the MEMS chips employ a combination of rigid frames and short strip-type beams to improve vibrational stability. To enhance sensitivity, our MEMS chips f...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-04-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/16/4/484 |
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