Study on Grinding Mechanism of Brake Pad with Copper Matrix Composites for High-Speed Train
The processing mechanism of copper matrix composites is very complex, for the particle phase and lubricating phase are randomly distributed in the copper matrix phase, and the characteristics of the three phases are completely different. Aiming at understanding the chip formation and the influence o...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Wiley
2019-01-01
|
| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2019/8970689 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Summary: | The processing mechanism of copper matrix composites is very complex, for the particle phase and lubricating phase are randomly distributed in the copper matrix phase, and the characteristics of the three phases are completely different. Aiming at understanding the chip formation and the influence of each phase of the material on the workpiece surface morphology, a single abrasive grain cutting experiment is carried out. Experiment results show that the cutting force increases with the increase in the cutting depth, but the increase amplitude is smaller. Extrusion of the abrasive particles causes plastic deformation of the copper matrix phase and brittle fracture of the particle phase and graphite phase. It results in the defects on the groove surface, such as pits, collapses and cracks, and holes. The brittle fracture of the graphite phase and the breaking and falling off of the particle phase block the plastic deformation of the copper alloy, which makes the copper alloy not forming ductile chips. The chip is mainly powdery. It shows that the brittle fracture is the main removal form of the brake pad material. The copper matrix phase on the surface of the groove produces obvious plastic deformation. The plastic deformation at the bottom is larger and has a certain degree of fibrosis appearing. |
|---|---|
| ISSN: | 1687-8434 1687-8442 |