Vogel, K., Wuensch, D., Shaporin, A., Mehner, J., Billep, D., & Wiemer, M. Crack propagation in micro-chevron-test samples of direct bonded silicon-silicon wafers. Gruppo Italiano Frattura.
Chicago Style (17th ed.) CitationVogel, K., D. Wuensch, A. Shaporin, J. Mehner, D. Billep, and M. Wiemer. Crack Propagation in Micro-chevron-test Samples of Direct Bonded Silicon-silicon Wafers. Gruppo Italiano Frattura.
MLA (9th ed.) CitationVogel, K., et al. Crack Propagation in Micro-chevron-test Samples of Direct Bonded Silicon-silicon Wafers. Gruppo Italiano Frattura.
Warning: These citations may not always be 100% accurate.