Study on the Electromigration Organization and Mechanical Properties of Sn2.5Ag0.7Cu0.1RE/Cu Solder Joints
In this study, we designed and manufactured an ideal electromigration testing device for soldering joints to solve the reliability problems caused by temperature and current density changes in the electromigration processes of micro solder joints. We analyzed the effects of temperature and current d...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-01-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/15/1/75 |
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