APA (7th ed.) Citation

Wang, Y., Zhang, K., Zhang, C., Huo, F., & Gao, Y. Study on the Electromigration Organization and Mechanical Properties of Sn2.5Ag0.7Cu0.1RE/Cu Solder Joints. MDPI AG.

Chicago Style (17th ed.) Citation

Wang, Yuming, Keke Zhang, Chao Zhang, Fupeng Huo, and Yijie Gao. Study on the Electromigration Organization and Mechanical Properties of Sn2.5Ag0.7Cu0.1RE/Cu Solder Joints. MDPI AG.

MLA (9th ed.) Citation

Wang, Yuming, et al. Study on the Electromigration Organization and Mechanical Properties of Sn2.5Ag0.7Cu0.1RE/Cu Solder Joints. MDPI AG.