Fabrication of SiC@Cu/Cu Composites with the Addition of SiC@Cu Powder by Magnetron Sputtering
In view of the surface engineering application of electrical contact materials, SiC ceramic particles were introduced into copper matrix composites by the hot-press sintering method for the sake of enhancing the service life of copper matrix electrical contact materials. Magnetron sputtering technol...
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| Format: | Article |
| Language: | English |
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Wiley
2021-01-01
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| Series: | International Journal of Photoenergy |
| Online Access: | http://dx.doi.org/10.1155/2021/6623776 |
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| author | Zhang Yunlong Li Wenbo Hu Ming Yi Hongyong Zhou Wei Ding Peiling Tang Lili |
| author_facet | Zhang Yunlong Li Wenbo Hu Ming Yi Hongyong Zhou Wei Ding Peiling Tang Lili |
| author_sort | Zhang Yunlong |
| collection | DOAJ |
| description | In view of the surface engineering application of electrical contact materials, SiC ceramic particles were introduced into copper matrix composites by the hot-press sintering method for the sake of enhancing the service life of copper matrix electrical contact materials. Magnetron sputtering technology was exploited to form the continuous copper film on the β-SiC powders in order to improve interface wettability between SiC powder and copper matrix. The SiC@Cu powders were treated by magnetron sputtering technology. Then, dynamic deposit behavior was described according to SEM results. The phase constitution, fracture morphology, relative density, porosity, Vickers hardness, and coefficient of thermal expansion of SiC@Cu/Cu composites with different SiC@Cu addition were analyzed in detail. The results showed that SiC@Cu powders with higher fraction in the SiC@Cu/Cu composites would decrease relative density and increase porosity, so it resulted in improvement of Vickers hardness. The addition of SiC@Cu decreased CTE values of the SiC@Cu/Cu composite, especially at high-level fraction SiC@Cu powder. |
| format | Article |
| id | doaj-art-579a8230a29f482db37c8655f27cdf48 |
| institution | Kabale University |
| issn | 1110-662X 1687-529X |
| language | English |
| publishDate | 2021-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | International Journal of Photoenergy |
| spelling | doaj-art-579a8230a29f482db37c8655f27cdf482025-02-03T05:57:51ZengWileyInternational Journal of Photoenergy1110-662X1687-529X2021-01-01202110.1155/2021/66237766623776Fabrication of SiC@Cu/Cu Composites with the Addition of SiC@Cu Powder by Magnetron SputteringZhang Yunlong0Li Wenbo1Hu Ming2Yi Hongyong3Zhou Wei4Ding Peiling5Tang Lili6College of Materials Science & Engineering, Jiamusi University, Jiamusi 154007, ChinaCollege of Materials Science & Engineering, Jiamusi University, Jiamusi 154007, ChinaCollege of Materials Science & Engineering, Jiamusi University, Jiamusi 154007, ChinaCollege of Materials Science & Engineering, Jiamusi University, Jiamusi 154007, ChinaAnyang Institute of Technology, Anyang 455000, ChinaCollege of Materials Science & Engineering, Jiamusi University, Jiamusi 154007, ChinaCollege of Materials Science & Engineering, Jiamusi University, Jiamusi 154007, ChinaIn view of the surface engineering application of electrical contact materials, SiC ceramic particles were introduced into copper matrix composites by the hot-press sintering method for the sake of enhancing the service life of copper matrix electrical contact materials. Magnetron sputtering technology was exploited to form the continuous copper film on the β-SiC powders in order to improve interface wettability between SiC powder and copper matrix. The SiC@Cu powders were treated by magnetron sputtering technology. Then, dynamic deposit behavior was described according to SEM results. The phase constitution, fracture morphology, relative density, porosity, Vickers hardness, and coefficient of thermal expansion of SiC@Cu/Cu composites with different SiC@Cu addition were analyzed in detail. The results showed that SiC@Cu powders with higher fraction in the SiC@Cu/Cu composites would decrease relative density and increase porosity, so it resulted in improvement of Vickers hardness. The addition of SiC@Cu decreased CTE values of the SiC@Cu/Cu composite, especially at high-level fraction SiC@Cu powder.http://dx.doi.org/10.1155/2021/6623776 |
| spellingShingle | Zhang Yunlong Li Wenbo Hu Ming Yi Hongyong Zhou Wei Ding Peiling Tang Lili Fabrication of SiC@Cu/Cu Composites with the Addition of SiC@Cu Powder by Magnetron Sputtering International Journal of Photoenergy |
| title | Fabrication of SiC@Cu/Cu Composites with the Addition of SiC@Cu Powder by Magnetron Sputtering |
| title_full | Fabrication of SiC@Cu/Cu Composites with the Addition of SiC@Cu Powder by Magnetron Sputtering |
| title_fullStr | Fabrication of SiC@Cu/Cu Composites with the Addition of SiC@Cu Powder by Magnetron Sputtering |
| title_full_unstemmed | Fabrication of SiC@Cu/Cu Composites with the Addition of SiC@Cu Powder by Magnetron Sputtering |
| title_short | Fabrication of SiC@Cu/Cu Composites with the Addition of SiC@Cu Powder by Magnetron Sputtering |
| title_sort | fabrication of sic cu cu composites with the addition of sic cu powder by magnetron sputtering |
| url | http://dx.doi.org/10.1155/2021/6623776 |
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