Fabrication of Ni-Mn Microprobe Structure with Low Internal Stress and High Hardness by Employing DC Electrodeposition

Due to its widely tunable mechanical property and incompatibility with most solders, Ni-Mn alloy can become a viable candidate in the fabrication of testing probe for microelectronic devices. In this study, the electrodeposition of Ni-Mn alloy in nickel sulphamate electrolyte with the addition of ma...

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Main Authors: Kuan-Hui Cheng, Fu-Je Chen, Chun-Ying Lee, Chao-Sung Lin, Jung-Tang Huang, Chang-Cheng Lan, Ping-Huan Tsou, Tzu-I Ho
Format: Article
Language:English
Published: Wiley 2014-01-01
Series:Advances in Materials Science and Engineering
Online Access:http://dx.doi.org/10.1155/2014/890814
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author Kuan-Hui Cheng
Fu-Je Chen
Chun-Ying Lee
Chao-Sung Lin
Jung-Tang Huang
Chang-Cheng Lan
Ping-Huan Tsou
Tzu-I Ho
author_facet Kuan-Hui Cheng
Fu-Je Chen
Chun-Ying Lee
Chao-Sung Lin
Jung-Tang Huang
Chang-Cheng Lan
Ping-Huan Tsou
Tzu-I Ho
author_sort Kuan-Hui Cheng
collection DOAJ
description Due to its widely tunable mechanical property and incompatibility with most solders, Ni-Mn alloy can become a viable candidate in the fabrication of testing probe for microelectronic devices. In this study, the electrodeposition of Ni-Mn alloy in nickel sulphamate electrolyte with the addition of manganese sulphate was investigated under direct current (DC) power source. The effects of current density and Mn2+ concentration in the electrolyte on the coating composition, cathodic efficiency, microstructure and mechanical properties were explored. The results showed that the raise of the Mn2+ concentration in the electrolyte alone did not effectively increase the Mn content in the coating but reduce the cathodic efficiency. On the other hand, increasing the current density facilitated the codeposition of the Mn and rendered the crystallite from coarse columnar grain to the refined one. Thus, both hardness and internal stress of the coating increased. The fabrication of testing probes at 1 A/dm2 was shown to satisfy the high hardness, low internal stress, reasonable fatigue life, and nonsticking requirements for this microelectronic application.
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institution Kabale University
issn 1687-8434
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language English
publishDate 2014-01-01
publisher Wiley
record_format Article
series Advances in Materials Science and Engineering
spelling doaj-art-4b367297ae454817ab8a64c3de6e574d2025-02-03T01:23:51ZengWileyAdvances in Materials Science and Engineering1687-84341687-84422014-01-01201410.1155/2014/890814890814Fabrication of Ni-Mn Microprobe Structure with Low Internal Stress and High Hardness by Employing DC ElectrodepositionKuan-Hui Cheng0Fu-Je Chen1Chun-Ying Lee2Chao-Sung Lin3Jung-Tang Huang4Chang-Cheng Lan5Ping-Huan Tsou6Tzu-I Ho7Department of Mechanical Engineering, National Taipei University of Technology, Taipei 10608, TaiwanDepartment of Materials Science and Engineering, National Taiwan University, Taipei 10617, TaiwanDepartment of Mechanical Engineering, National Taipei University of Technology, Taipei 10608, TaiwanDepartment of Materials Science and Engineering, National Taiwan University, Taipei 10617, TaiwanDepartment of Mechanical Engineering, National Taipei University of Technology, Taipei 10608, TaiwanCCP Contact Probes Co., Ltd., Taipei 22061, TaiwanCCP Contact Probes Co., Ltd., Taipei 22061, TaiwanCCP Contact Probes Co., Ltd., Taipei 22061, TaiwanDue to its widely tunable mechanical property and incompatibility with most solders, Ni-Mn alloy can become a viable candidate in the fabrication of testing probe for microelectronic devices. In this study, the electrodeposition of Ni-Mn alloy in nickel sulphamate electrolyte with the addition of manganese sulphate was investigated under direct current (DC) power source. The effects of current density and Mn2+ concentration in the electrolyte on the coating composition, cathodic efficiency, microstructure and mechanical properties were explored. The results showed that the raise of the Mn2+ concentration in the electrolyte alone did not effectively increase the Mn content in the coating but reduce the cathodic efficiency. On the other hand, increasing the current density facilitated the codeposition of the Mn and rendered the crystallite from coarse columnar grain to the refined one. Thus, both hardness and internal stress of the coating increased. The fabrication of testing probes at 1 A/dm2 was shown to satisfy the high hardness, low internal stress, reasonable fatigue life, and nonsticking requirements for this microelectronic application.http://dx.doi.org/10.1155/2014/890814
spellingShingle Kuan-Hui Cheng
Fu-Je Chen
Chun-Ying Lee
Chao-Sung Lin
Jung-Tang Huang
Chang-Cheng Lan
Ping-Huan Tsou
Tzu-I Ho
Fabrication of Ni-Mn Microprobe Structure with Low Internal Stress and High Hardness by Employing DC Electrodeposition
Advances in Materials Science and Engineering
title Fabrication of Ni-Mn Microprobe Structure with Low Internal Stress and High Hardness by Employing DC Electrodeposition
title_full Fabrication of Ni-Mn Microprobe Structure with Low Internal Stress and High Hardness by Employing DC Electrodeposition
title_fullStr Fabrication of Ni-Mn Microprobe Structure with Low Internal Stress and High Hardness by Employing DC Electrodeposition
title_full_unstemmed Fabrication of Ni-Mn Microprobe Structure with Low Internal Stress and High Hardness by Employing DC Electrodeposition
title_short Fabrication of Ni-Mn Microprobe Structure with Low Internal Stress and High Hardness by Employing DC Electrodeposition
title_sort fabrication of ni mn microprobe structure with low internal stress and high hardness by employing dc electrodeposition
url http://dx.doi.org/10.1155/2014/890814
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