Cheng, K., Chen, F., Lee, C., Lin, C., Huang, J., Lan, C., . . . Ho, T. Fabrication of Ni-Mn Microprobe Structure with Low Internal Stress and High Hardness by Employing DC Electrodeposition. Wiley.
Chicago Style (17th ed.) CitationCheng, Kuan-Hui, Fu-Je Chen, Chun-Ying Lee, Chao-Sung Lin, Jung-Tang Huang, Chang-Cheng Lan, Ping-Huan Tsou, and Tzu-I Ho. Fabrication of Ni-Mn Microprobe Structure with Low Internal Stress and High Hardness by Employing DC Electrodeposition. Wiley.
MLA (9th ed.) CitationCheng, Kuan-Hui, et al. Fabrication of Ni-Mn Microprobe Structure with Low Internal Stress and High Hardness by Employing DC Electrodeposition. Wiley.
Warning: These citations may not always be 100% accurate.