Wang, Y., Wu, A., Zhang, L., Jin, F., & Liu, X. Investigating the Effect of Solid Components on Yield Stress for Cemented Paste Backfill via Uniform Design. Wiley.
Chicago Style (17th ed.) CitationWang, Yong, Aixiang Wu, Lianfu Zhang, Fei Jin, and Xiaohui Liu. Investigating the Effect of Solid Components on Yield Stress for Cemented Paste Backfill via Uniform Design. Wiley.
MLA (9th ed.) CitationWang, Yong, et al. Investigating the Effect of Solid Components on Yield Stress for Cemented Paste Backfill via Uniform Design. Wiley.
Warning: These citations may not always be 100% accurate.