APA (7th ed.) Citation

Saffaj, S., Mantovani, D., & Kolliopoulos, G. Sustainable Leaching of Cu, Ni, and Au from Waste Printed Circuit Boards Using Choline Chloride-Based Deep Eutectic Solvents. MDPI AG.

Chicago Style (17th ed.) Citation

Saffaj, Sara, Diego Mantovani, and Georgios Kolliopoulos. Sustainable Leaching of Cu, Ni, and Au from Waste Printed Circuit Boards Using Choline Chloride-Based Deep Eutectic Solvents. MDPI AG.

MLA (9th ed.) Citation

Saffaj, Sara, et al. Sustainable Leaching of Cu, Ni, and Au from Waste Printed Circuit Boards Using Choline Chloride-Based Deep Eutectic Solvents. MDPI AG.