APA (7th ed.) Citation

Wang, L., Luo, X., Jia, Y., Li, Y., Zhou, R., Zhang, H., . . . Li, Y. Effect of Ultrasonic Power on the Microstructure and Properties of a Semi-Solid Slurry of SnSbCu11-6 Alloy. MDPI AG.

Chicago Style (17th ed.) Citation

Wang, Lei, Xiaobin Luo, Yuanwei Jia, Yongkun Li, Rongfeng Zhou, Hao Zhang, Dingdong Huo, and Yao Li. Effect of Ultrasonic Power on the Microstructure and Properties of a Semi-Solid Slurry of SnSbCu11-6 Alloy. MDPI AG.

MLA (9th ed.) Citation

Wang, Lei, et al. Effect of Ultrasonic Power on the Microstructure and Properties of a Semi-Solid Slurry of SnSbCu11-6 Alloy. MDPI AG.