Preparation of Ag2O modified silica abrasives and their chemical mechanical polishing performances on sapphire
Abstract The chemical mechanical polishing (CMP) process has become a widely accepted global planarization technology. The abrasive material is one of the key elements in CMP. In the presented paper, an Ag-doped colloidal SiO2 abrasive is synthesized by a seed-induced growth method. It is characteri...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Tsinghua University Press
2017-06-01
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| Series: | Friction |
| Subjects: | |
| Online Access: | http://link.springer.com/article/10.1007/s40544-017-0156-8 |
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