Photocatalytic Surface Modification of PI Film for Electroless Copper Plating
This study investigated the surface modification of polyimide (PI) film through TiO2 photocatalytic treatment. The effects of TiO2 content, treatment duration, and UV power on the surface topography, surface contact angle, and adhesion strength of the surface-modified PI films were investigated. The...
Saved in:
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Wiley
2018-01-01
|
| Series: | Advances in Condensed Matter Physics |
| Online Access: | http://dx.doi.org/10.1155/2018/1619581 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1832562042867810304 |
|---|---|
| author | Wenxia Zhao Zenglin Wang Liang Qiao Shiwei Liu Hongjian Zhao Yani Yan |
| author_facet | Wenxia Zhao Zenglin Wang Liang Qiao Shiwei Liu Hongjian Zhao Yani Yan |
| author_sort | Wenxia Zhao |
| collection | DOAJ |
| description | This study investigated the surface modification of polyimide (PI) film through TiO2 photocatalytic treatment. The effects of TiO2 content, treatment duration, and UV power on the surface topography, surface contact angle, and adhesion strength of the surface-modified PI films were investigated. The results indicated that, after surface modification under the optimal photocatalytic conditions, the surface contact angle of the PI film decreased from 84.4° to 38.8°, and the adhesion strength between the PI film and the electroless copper film reached 0.78 kN/m. X-ray photoelectron spectroscopy analysis further demonstrated that carboxyl groups formed on the surface of the PI film after photocatalytic treatment. The surface hydrophilicity and adhesion strength of the surface-modified PI film were enhanced due to the numerous carboxyl groups formed on its surface. Therefore, the photocatalytic treatment is an environmentally friendly and effective method for the surface modification of PI films. |
| format | Article |
| id | doaj-art-44a1667e5c4f4b2aba20d90d97f4fd89 |
| institution | Kabale University |
| issn | 1687-8108 1687-8124 |
| language | English |
| publishDate | 2018-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Advances in Condensed Matter Physics |
| spelling | doaj-art-44a1667e5c4f4b2aba20d90d97f4fd892025-02-03T01:23:37ZengWileyAdvances in Condensed Matter Physics1687-81081687-81242018-01-01201810.1155/2018/16195811619581Photocatalytic Surface Modification of PI Film for Electroless Copper PlatingWenxia Zhao0Zenglin Wang1Liang Qiao2Shiwei Liu3Hongjian Zhao4Yani Yan5School of Chemistry and Chemical Engineering, Ningxia Normal University, Guyuan 756000, ChinaKey Laboratory of Applied Surface and Colloid Chemistry, Ministry of Education, School of Chemistry and Chemical Engineering, Shaanxi Normal University, Xi’an 710119, ChinaDepartment of Chemical and Biological Engineering, University at Buffalo (SUNY), Buffalo, NY 14260, USASchool of Chemistry and Chemical Engineering, Ningxia Normal University, Guyuan 756000, ChinaSchool of Chemistry and Chemical Engineering, Ningxia Normal University, Guyuan 756000, ChinaSchool of Chemistry and Chemical Engineering, Ningxia Normal University, Guyuan 756000, ChinaThis study investigated the surface modification of polyimide (PI) film through TiO2 photocatalytic treatment. The effects of TiO2 content, treatment duration, and UV power on the surface topography, surface contact angle, and adhesion strength of the surface-modified PI films were investigated. The results indicated that, after surface modification under the optimal photocatalytic conditions, the surface contact angle of the PI film decreased from 84.4° to 38.8°, and the adhesion strength between the PI film and the electroless copper film reached 0.78 kN/m. X-ray photoelectron spectroscopy analysis further demonstrated that carboxyl groups formed on the surface of the PI film after photocatalytic treatment. The surface hydrophilicity and adhesion strength of the surface-modified PI film were enhanced due to the numerous carboxyl groups formed on its surface. Therefore, the photocatalytic treatment is an environmentally friendly and effective method for the surface modification of PI films.http://dx.doi.org/10.1155/2018/1619581 |
| spellingShingle | Wenxia Zhao Zenglin Wang Liang Qiao Shiwei Liu Hongjian Zhao Yani Yan Photocatalytic Surface Modification of PI Film for Electroless Copper Plating Advances in Condensed Matter Physics |
| title | Photocatalytic Surface Modification of PI Film for Electroless Copper Plating |
| title_full | Photocatalytic Surface Modification of PI Film for Electroless Copper Plating |
| title_fullStr | Photocatalytic Surface Modification of PI Film for Electroless Copper Plating |
| title_full_unstemmed | Photocatalytic Surface Modification of PI Film for Electroless Copper Plating |
| title_short | Photocatalytic Surface Modification of PI Film for Electroless Copper Plating |
| title_sort | photocatalytic surface modification of pi film for electroless copper plating |
| url | http://dx.doi.org/10.1155/2018/1619581 |
| work_keys_str_mv | AT wenxiazhao photocatalyticsurfacemodificationofpifilmforelectrolesscopperplating AT zenglinwang photocatalyticsurfacemodificationofpifilmforelectrolesscopperplating AT liangqiao photocatalyticsurfacemodificationofpifilmforelectrolesscopperplating AT shiweiliu photocatalyticsurfacemodificationofpifilmforelectrolesscopperplating AT hongjianzhao photocatalyticsurfacemodificationofpifilmforelectrolesscopperplating AT yaniyan photocatalyticsurfacemodificationofpifilmforelectrolesscopperplating |