APA (7th ed.) Citation

Liu, B., Wang, Y., & Yang, H. Material Removal Mechanism and Evolution of Subsurface Defects during Nanocutting of Monocrystalline Cu. Wiley.

Chicago Style (17th ed.) Citation

Liu, Bing, Yurong Wang, and Haijie Yang. Material Removal Mechanism and Evolution of Subsurface Defects During Nanocutting of Monocrystalline Cu. Wiley.

MLA (9th ed.) Citation

Liu, Bing, et al. Material Removal Mechanism and Evolution of Subsurface Defects During Nanocutting of Monocrystalline Cu. Wiley.

Warning: These citations may not always be 100% accurate.