Digital Twin for Developing and Verifying Semiconductor Packaging License Models
The traditional semiconductor packaging training process is time-consuming and carries the risk of damaging precision equipment due to improper operation. Additionally, the retirement of experienced trainers has led to loss of specialized training and testing expertise. To address these challenges,...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-04-01
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| Series: | Engineering Proceedings |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2673-4591/89/1/45 |
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| Summary: | The traditional semiconductor packaging training process is time-consuming and carries the risk of damaging precision equipment due to improper operation. Additionally, the retirement of experienced trainers has led to loss of specialized training and testing expertise. To address these challenges, digital twin technology is applied to training packaging engineers. We conducted an empirical study at the packaging production line of the Minghsin University of Science and Technology to address talent training bottlenecks and imbalances between supply and demand. First, an integrated software and hardware system was designed by combining digital twin and mixed reality (MR). The development process of the digital twin system for the wafer-dicing machine includes on-site visits, machine operation instructions, certification content development, expert validity construction, small-scale testing and modifications. We compared the pre- and post-experiment scores of industry experts to evaluate the operation time of five participants and their feedback. Digital twin and MR for simulated training increased proficiency in operation. The digital twin training and certification model developed in this study improved students’ pass rates in certification exams. |
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| ISSN: | 2673-4591 |