EQUIPMENT FOR NONDESTRUCTIVE TESTING OF SILICON WAFERS SUBMICRON TOPOLOGY DURING THE FABRICATION OF INTEGRATED CIRCUITS

EQUIPMENT FOR NONDESTRUCTIVE TESTING OF SILICON WAFERS SUBMICRON TOPOLOGY DURING THE FABRICATION OF INTEGRATED CIRCUITS

The advantages of using an atomic force microscopy in manufacturing of submicron integrated circuits are described. The possibilities of characterizing the surface morphology and the etching profile for silicon substrate and bus lines, estimation of the periodicity and size of bus lines, geometrical...

Full description

Saved in:
Bibliographic Details
Main Authors: S. A. Chizhik, S. P. Basalaev, V. A. Pilipenko, A. L. Khudoley, T. A. Kuznetsova, V. V. Chikunov, A. A. Suslov
Format: Article
Language:English
Published: Belarusian National Technical University 2015-03-01
Series:Приборы и методы измерений
Subjects:
submicron topology control
optic and atomic force microscopy
Online Access:https://pimi.bntu.by/jour/article/view/9
Tags: Add Tag
No Tags, Be the first to tag this record!

Similar Items

Similar Items