Modulation of the electromagnetic shielding effectiveness through micro/macrostructure design for electronic packaging
Abstract Lightweight electronic packaging that provides mechanical protection, cooling ability, and customizable electromagnetic interference (EMI) shielding effectiveness (SE) is needed for next-generation electronics. Although electronic packaging solutions with excellent EMI SE exist, there is li...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Portfolio
2024-07-01
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| Series: | NPG Asia Materials |
| Online Access: | https://doi.org/10.1038/s41427-024-00554-8 |
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