Temperature Effects in Packaged RF MEMS Switches with Optimized Gold Electroplating Process

Temperature Effects in Packaged RF MEMS Switches with Optimized Gold Electroplating Process

Due to its excellent electrical performance, mechanical reliability, and thermal stability, electroplated gold is still the most commonly used material for movable beams in RF MEMS switches. This paper investigates the influence of process conditions on the quality and growth rate of gold electropla...

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Bibliographic Details
Main Authors: Lifeng Wang, Lili Jiang, Ning Ma, Xiaodong Huang
Format: Article
Language:English
Published: MDPI AG 2024-08-01
Series:Micromachines
Subjects:
RF MEMS switch
gold electroplating process
temperature effects
pull-in voltage
lifetime
Online Access:https://www.mdpi.com/2072-666X/15/9/1085
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