APA (7th ed.) Citation

Wang, L., Jiang, L., Ma, N., & Huang, X. Temperature Effects in Packaged RF MEMS Switches with Optimized Gold Electroplating Process. MDPI AG.

Chicago Style (17th ed.) Citation

Wang, Lifeng, Lili Jiang, Ning Ma, and Xiaodong Huang. Temperature Effects in Packaged RF MEMS Switches with Optimized Gold Electroplating Process. MDPI AG.

MLA (9th ed.) Citation

Wang, Lifeng, et al. Temperature Effects in Packaged RF MEMS Switches with Optimized Gold Electroplating Process. MDPI AG.