Growth Kinetics of Ni<sub>3</sub>Ga<sub>7</sub> in Ni/Ga System During Interfacial Reaction Diffusion
In order to apply Ga alloys to flexible and wearable electronic devices, it is crucial to verify the mechanical reliability of interconnections between Ga and various metal electrodes. This study investigated the phase transformation kinetics and microstructural evolution in the Ni/Ga couple. The di...
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| Main Authors: | Jun Peng, Tao Wang, Shuai Zhang |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-05-01
|
| Series: | Crystals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2073-4352/15/6/520 |
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