Influence of Cu(II) Ion Concentration on Copper Electrodeposition from Deep Eutectic Solvent on Inert Substrate

Influence of Cu(II) Ion Concentration on Copper Electrodeposition from Deep Eutectic Solvent on Inert Substrate

The electrochemical behavior of copper (II) on glassy carbon from an eutectic mixture of choline chloride (ChCl) and ethylene glycol (EG) was investigated using cyclic voltammetry (CV). The redox and deposition processes were studied for electrolyte concentrations of 0.01 M and 0.5 M Cu(II), with pa...

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Bibliographic Details
Main Authors: Vesna S. Cvetković, Nataša M. Petrović, Nebojša D. Nikolić, Jovan N. Jovićević
Format: Article
Language:English
Published: MDPI AG 2025-06-01
Series:Metals
Subjects:
copper
electrodeposition
ethaline
morphology
rose-like forms
carrot-like or the needle-like dendrites
Online Access:https://www.mdpi.com/2075-4701/15/7/716
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