Egg Microinjection for the Silkworm Bombyx mori

The silkworm Bombyx mori has been extensively utilized in sericulture and serves as a representative model insect of Lepidoptera in various fields of life sciences and applied research. In recent years, its significance has further increased in molecular genetics and functional genomics. Germline tr...

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Bibliographic Details
Main Authors: Hayato Yamada, Toshinobu Yaginuma, Keisuke Mase, Teruyuki Niimi
Format: Article
Language:English
Published: Bio-protocol LLC 2025-05-01
Series:Bio-Protocol
Online Access:https://bio-protocol.org/en/bpdetail?id=5317&type=0
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Summary:The silkworm Bombyx mori has been extensively utilized in sericulture and serves as a representative model insect of Lepidoptera in various fields of life sciences and applied research. In recent years, its significance has further increased in molecular genetics and functional genomics. Germline transformation and genome editing in B. mori require the injection of vector solutions into early embryos; however, the thick eggshell of B. mori presents a significant challenge for microinjection. Conventional methods involve arranging eggs, pre-pierced with a tungsten needle, followed by solution injection, making the process both time-consuming and technically demanding. Here, we describe a simplified and more efficient microinjection protocol. Unlike conventional approaches, our method eliminates the need for egg removal from the egg-laying sheet and egg alignment on the slide glass by allowing injections to be performed directly on eggs retained on the egg-laying sheet. A thick-walled glass capillary, capable of penetrating the rigid eggshell, is used to directly pierce the eggshell and deliver the solution. By eliminating the need for egg alignment and micromanipulator operation, this protocol significantly enhances efficiency, enabling higher-throughput embryo injections within a shorter time frame. Moreover, this approach holds potential for application to other insect species with similarly thick eggshells.
ISSN:2331-8325