Feature analysis aided design of lightweight heat sink from network structures
Summary: The advent of electronic devices has revolutionized engineering applications and fundamentally transformed society. However, their lifespan is significantly impacted by operational temperatures, as excess heat can elevate localized temperatures (hot spot) and damage components. Efficient he...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-02-01
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| Series: | iScience |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2589004224028578 |
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