Feature analysis aided design of lightweight heat sink from network structures
Summary: The advent of electronic devices has revolutionized engineering applications and fundamentally transformed society. However, their lifespan is significantly impacted by operational temperatures, as excess heat can elevate localized temperatures (hot spot) and damage components. Efficient he...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-02-01
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| Series: | iScience |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2589004224028578 |
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| author | Tianlin Luo Changliang Zhu Baowen Li Xiangying Shen Guimei Zhu |
| author_facet | Tianlin Luo Changliang Zhu Baowen Li Xiangying Shen Guimei Zhu |
| author_sort | Tianlin Luo |
| collection | DOAJ |
| description | Summary: The advent of electronic devices has revolutionized engineering applications and fundamentally transformed society. However, their lifespan is significantly impacted by operational temperatures, as excess heat can elevate localized temperatures (hot spot) and damage components. Efficient heat dissipation through heat sinks is therefore crucial. In this research, we optimized intricate network structures for designing heat sink fins. These novel configurations provide thermal dissipation capabilities equivalent to conventional designs while substantially reducing weight. We utilized 3D printing to manufacture these designs and confirmed their effectiveness through experimental validation. The optimized network-based heat sink designs exhibit a weight reduction of approximately 50% while maintaining cooling efficiency comparable to commercially available models. Additionally, we introduced the “effective heat transfer coefficient heff” to assess heat dissipation effectiveness. This factor considers temperature fluctuations under thermal loads and the heat sink’s surface area. The refined heat sink designs were successfully implemented to cool light emitting diodes (LEDs） in practical applications. |
| format | Article |
| id | doaj-art-3b923bfc779548249e60009218652f86 |
| institution | Kabale University |
| issn | 2589-0042 |
| language | English |
| publishDate | 2025-02-01 |
| publisher | Elsevier |
| record_format | Article |
| series | iScience |
| spelling | doaj-art-3b923bfc779548249e60009218652f862025-01-29T05:01:36ZengElsevieriScience2589-00422025-02-01282111630Feature analysis aided design of lightweight heat sink from network structuresTianlin Luo0Changliang Zhu1Baowen Li2Xiangying Shen3Guimei Zhu4Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, P.R. ChinaDepartment of Physics, Southern University of Science and Technology, Shenzhen, P.R. ChinaDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, P.R. China; Department of Physics, Southern University of Science and Technology, Shenzhen, P.R. China; School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, P.R. China; Shenzhen International Quantum Academy, Shenzhen 518017, P.R. ChinaDepartment of Physics, Southern University of Science and Technology, Shenzhen, P.R. China; Corresponding authorSchool of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, P.R. China; Corresponding authorSummary: The advent of electronic devices has revolutionized engineering applications and fundamentally transformed society. However, their lifespan is significantly impacted by operational temperatures, as excess heat can elevate localized temperatures (hot spot) and damage components. Efficient heat dissipation through heat sinks is therefore crucial. In this research, we optimized intricate network structures for designing heat sink fins. These novel configurations provide thermal dissipation capabilities equivalent to conventional designs while substantially reducing weight. We utilized 3D printing to manufacture these designs and confirmed their effectiveness through experimental validation. The optimized network-based heat sink designs exhibit a weight reduction of approximately 50% while maintaining cooling efficiency comparable to commercially available models. Additionally, we introduced the “effective heat transfer coefficient heff” to assess heat dissipation effectiveness. This factor considers temperature fluctuations under thermal loads and the heat sink’s surface area. The refined heat sink designs were successfully implemented to cool light emitting diodes (LEDs） in practical applications.http://www.sciencedirect.com/science/article/pii/S2589004224028578Heat transferThermal engineeringMaterials scienceComputational materials science |
| spellingShingle | Tianlin Luo Changliang Zhu Baowen Li Xiangying Shen Guimei Zhu Feature analysis aided design of lightweight heat sink from network structures iScience Heat transfer Thermal engineering Materials science Computational materials science |
| title | Feature analysis aided design of lightweight heat sink from network structures |
| title_full | Feature analysis aided design of lightweight heat sink from network structures |
| title_fullStr | Feature analysis aided design of lightweight heat sink from network structures |
| title_full_unstemmed | Feature analysis aided design of lightweight heat sink from network structures |
| title_short | Feature analysis aided design of lightweight heat sink from network structures |
| title_sort | feature analysis aided design of lightweight heat sink from network structures |
| topic | Heat transfer Thermal engineering Materials science Computational materials science |
| url | http://www.sciencedirect.com/science/article/pii/S2589004224028578 |
| work_keys_str_mv | AT tianlinluo featureanalysisaideddesignoflightweightheatsinkfromnetworkstructures AT changliangzhu featureanalysisaideddesignoflightweightheatsinkfromnetworkstructures AT baowenli featureanalysisaideddesignoflightweightheatsinkfromnetworkstructures AT xiangyingshen featureanalysisaideddesignoflightweightheatsinkfromnetworkstructures AT guimeizhu featureanalysisaideddesignoflightweightheatsinkfromnetworkstructures |