A 0.9 V, 8T2R nvSRAM Memory Cell with High Density and Improved Storage/Restoration Time in 28 nm Technology Node

Combining with a static random-access memory (SRAM) and resistive memory (RRAM), an improved 8T2R nonvolatile SRAM (nvSRAM) memory cell is proposed in this study. With differential mode, a pair of 1T1R RRAM is added to 6T SRAM storage node. By optimizing the connection and layout scheme, the power c...

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Main Authors: Jiayu Yin, Wenli Liao, Chengying Chen
Format: Article
Language:English
Published: Wiley 2023-01-01
Series:Active and Passive Electronic Components
Online Access:http://dx.doi.org/10.1155/2023/2364341
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author Jiayu Yin
Wenli Liao
Chengying Chen
author_facet Jiayu Yin
Wenli Liao
Chengying Chen
author_sort Jiayu Yin
collection DOAJ
description Combining with a static random-access memory (SRAM) and resistive memory (RRAM), an improved 8T2R nonvolatile SRAM (nvSRAM) memory cell is proposed in this study. With differential mode, a pair of 1T1R RRAM is added to 6T SRAM storage node. By optimizing the connection and layout scheme, the power consumption is reduced and the data stability is improved. The nvSRAM memory cell is realized with UMC CMOS 28 nm 1p9m process. When the power supply voltage is 0.9 V, the static noise/read/write margin is 0.35 V, 0.16 V, and 0.41 V, respectively. The data storage/restoration time is 0.21 ns and 0.18 ns, respectively, with an active area of 0.97 μm2.
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institution Kabale University
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publishDate 2023-01-01
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series Active and Passive Electronic Components
spelling doaj-art-3b392060eddc42cba0093f2e350ec0482025-08-20T03:55:36ZengWileyActive and Passive Electronic Components1563-50312023-01-01202310.1155/2023/2364341A 0.9 V, 8T2R nvSRAM Memory Cell with High Density and Improved Storage/Restoration Time in 28 nm Technology NodeJiayu Yin0Wenli Liao1Chengying Chen2School of Opto-Electronic and Communication EngineeringSchool of Opto-Electronic and Communication EngineeringSchool of Opto-Electronic and Communication EngineeringCombining with a static random-access memory (SRAM) and resistive memory (RRAM), an improved 8T2R nonvolatile SRAM (nvSRAM) memory cell is proposed in this study. With differential mode, a pair of 1T1R RRAM is added to 6T SRAM storage node. By optimizing the connection and layout scheme, the power consumption is reduced and the data stability is improved. The nvSRAM memory cell is realized with UMC CMOS 28 nm 1p9m process. When the power supply voltage is 0.9 V, the static noise/read/write margin is 0.35 V, 0.16 V, and 0.41 V, respectively. The data storage/restoration time is 0.21 ns and 0.18 ns, respectively, with an active area of 0.97 μm2.http://dx.doi.org/10.1155/2023/2364341
spellingShingle Jiayu Yin
Wenli Liao
Chengying Chen
A 0.9 V, 8T2R nvSRAM Memory Cell with High Density and Improved Storage/Restoration Time in 28 nm Technology Node
Active and Passive Electronic Components
title A 0.9 V, 8T2R nvSRAM Memory Cell with High Density and Improved Storage/Restoration Time in 28 nm Technology Node
title_full A 0.9 V, 8T2R nvSRAM Memory Cell with High Density and Improved Storage/Restoration Time in 28 nm Technology Node
title_fullStr A 0.9 V, 8T2R nvSRAM Memory Cell with High Density and Improved Storage/Restoration Time in 28 nm Technology Node
title_full_unstemmed A 0.9 V, 8T2R nvSRAM Memory Cell with High Density and Improved Storage/Restoration Time in 28 nm Technology Node
title_short A 0.9 V, 8T2R nvSRAM Memory Cell with High Density and Improved Storage/Restoration Time in 28 nm Technology Node
title_sort 0 9 v 8t2r nvsram memory cell with high density and improved storage restoration time in 28 nm technology node
url http://dx.doi.org/10.1155/2023/2364341
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