Improved Numerical-Analytical Thermal Modeling Method of the PCB With Considering Radiation Heat Transfer and Calculation of Components’ Temperature
The previous work relating to the numerical-analytical coupling method for steady-state thermal analysis of the laminated PCB structure is first briefly reviewed. The Fourier-series analytical solution of temperature and the finite volume method were linked together for thermally modeling the PCB. F...
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| Main Author: | |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2021-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9466496/ |
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