Fabrication of Low-Roughness Au/Ti/ SiO2/Si Substrates for Nanopatterning of 16-Mercapto Hexadecanoic Acid (MHA) by Dip-Pen-Nanolithography

Silicon based low-roughness Au/Ti/SiO2/Si substrates were fabricated using standard IC fabrication processes. Evolution of surface roughness during substrate fabrication process was studied. Fabrication process steps, namely, thermal oxidation and e-beam evaporation for ultra-thin Ti(~ 5 nm)/Au(22 n...

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Bibliographic Details
Main Authors: A. Kumar, P.B. Agarwal, S.K. Gupta, A.K. Sharma, D. Kumar, Chandra Shekhar
Format: Article
Language:English
Published: Sumy State University 2012-06-01
Series:Журнал нано- та електронної фізики
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Online Access:http://jnep.sumdu.edu.ua/download/numbers/2012/2/articles/jnep_2012_V4_02022.pdf
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Summary:Silicon based low-roughness Au/Ti/SiO2/Si substrates were fabricated using standard IC fabrication processes. Evolution of surface roughness during substrate fabrication process was studied. Fabrication process steps, namely, thermal oxidation and e-beam evaporation for ultra-thin Ti(~ 5 nm)/Au(22 nm) films, were optimized to result in surface r.m.s roughness ~ 0.2 m and ~ 1.0 nm, after thermal oxidation and Ti/Au deposition steps respectively. Surface roughness was estimated by atomic force microscope (AFM) imaging and image analysis. Nano-patterning experiments using thiol based 16-MHA molecular-ink on fabricated substrates were carried out, under controlled environment conditions, by dip-pen-nanolitho-graphy (DPN) technique. Minimum line-width ~ 60 nm and circular dots radius ~ 175 nm were patterned.
ISSN:2077-6772