A tree-shaped high thermal conductivity channel in a stacked chip with minimizing maximum temperature difference and entropy generation rate
Combining constructal theory with entropy-generation-minimization theory, a model of a stacked chip with tree-shaped high-thermal-conductivity channels (TSHTCC) is established, and its performance are optimized with minimizing non-dimensional maximum temperature-difference (MTD) and non-dimensional...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-02-01
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| Series: | Case Studies in Thermal Engineering |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X24017659 |
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| author | Xuetao Xi Huijun Feng Lingen Chen Yanlin Ge |
| author_facet | Xuetao Xi Huijun Feng Lingen Chen Yanlin Ge |
| author_sort | Xuetao Xi |
| collection | DOAJ |
| description | Combining constructal theory with entropy-generation-minimization theory, a model of a stacked chip with tree-shaped high-thermal-conductivity channels (TSHTCC) is established, and its performance are optimized with minimizing non-dimensional maximum temperature-difference (MTD) and non-dimensional entropy-generation-rate (EGR), respectively. Effects of length ratio of first order channel to elemental channel, length and width of first order channel, heat-generation-rate per volume, temperature of heat sink and thermal-conductivity of TSHTCC on its MTD and EGR are analyzed. The results show that optimal construct of TSHTCC obtained with minimum EGR objective stretches slightly towards the center than that with minimum MTD objective. When thickness is 28 μm and width of second order channel is 1500 μm, non-dimensional MTD reaches its minimum at value of 0.824, and is reduced by 17.6 % compared to initial design. When thickness is 29 μm and width of second order channel is 1500 μm, non-dimensional EGR reaches its minimum at value of 0.759, and is reduced by 24.1 % compared to initial design. Non-dimensional MTD and non-dimensional EGR are reduced by 67.9 % and 83.5 %, respectively, compared to those of a model without TSHTCC. Therefore, heat dissipation performances of stacked chip are increased. |
| format | Article |
| id | doaj-art-36e2dac5e5fe4d8d9c8d9aae47501fbb |
| institution | Kabale University |
| issn | 2214-157X |
| language | English |
| publishDate | 2025-02-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Case Studies in Thermal Engineering |
| spelling | doaj-art-36e2dac5e5fe4d8d9c8d9aae47501fbb2025-02-02T05:27:18ZengElsevierCase Studies in Thermal Engineering2214-157X2025-02-0166105734A tree-shaped high thermal conductivity channel in a stacked chip with minimizing maximum temperature difference and entropy generation rateXuetao Xi0Huijun Feng1Lingen Chen2Yanlin Ge3Hubei Provincial Key Laboratory of Chemical Equipment Intensification and Intrinsic Safety, Wuhan Institute of Technology, Wuhan, 430205, PR China; Hubei Provincial Engineering Technology Research Center of Green Chemical Equipment, Wuhan Institute of Technology, Wuhan, 430205, PR China; Institute of Thermal Science and Power Engineering, Wuhan Institute of Technology, Wuhan, 430205, PR China; School of Mechanical & Electrical Engineering, Wuhan Institute of Technology, Wuhan, 430205, PR ChinaHubei Provincial Key Laboratory of Chemical Equipment Intensification and Intrinsic Safety, Wuhan Institute of Technology, Wuhan, 430205, PR China; Hubei Provincial Engineering Technology Research Center of Green Chemical Equipment, Wuhan Institute of Technology, Wuhan, 430205, PR China; Institute of Thermal Science and Power Engineering, Wuhan Institute of Technology, Wuhan, 430205, PR China; School of Mechanical & Electrical Engineering, Wuhan Institute of Technology, Wuhan, 430205, PR ChinaHubei Provincial Key Laboratory of Chemical Equipment Intensification and Intrinsic Safety, Wuhan Institute of Technology, Wuhan, 430205, PR China; Hubei Provincial Engineering Technology Research Center of Green Chemical Equipment, Wuhan Institute of Technology, Wuhan, 430205, PR China; Institute of Thermal Science and Power Engineering, Wuhan Institute of Technology, Wuhan, 430205, PR China; School of Mechanical & Electrical Engineering, Wuhan Institute of Technology, Wuhan, 430205, PR China; Corresponding author. Hubei Provincial Key Laboratory of Chemical Equipment Intensification and Intrinsic Safety, Wuhan Institute of Technology, Wuhan, 430205, PR China.Hubei Provincial Key Laboratory of Chemical Equipment Intensification and Intrinsic Safety, Wuhan Institute of Technology, Wuhan, 430205, PR China; Hubei Provincial Engineering Technology Research Center of Green Chemical Equipment, Wuhan Institute of Technology, Wuhan, 430205, PR China; Institute of Thermal Science and Power Engineering, Wuhan Institute of Technology, Wuhan, 430205, PR China; School of Mechanical & Electrical Engineering, Wuhan Institute of Technology, Wuhan, 430205, PR ChinaCombining constructal theory with entropy-generation-minimization theory, a model of a stacked chip with tree-shaped high-thermal-conductivity channels (TSHTCC) is established, and its performance are optimized with minimizing non-dimensional maximum temperature-difference (MTD) and non-dimensional entropy-generation-rate (EGR), respectively. Effects of length ratio of first order channel to elemental channel, length and width of first order channel, heat-generation-rate per volume, temperature of heat sink and thermal-conductivity of TSHTCC on its MTD and EGR are analyzed. The results show that optimal construct of TSHTCC obtained with minimum EGR objective stretches slightly towards the center than that with minimum MTD objective. When thickness is 28 μm and width of second order channel is 1500 μm, non-dimensional MTD reaches its minimum at value of 0.824, and is reduced by 17.6 % compared to initial design. When thickness is 29 μm and width of second order channel is 1500 μm, non-dimensional EGR reaches its minimum at value of 0.759, and is reduced by 24.1 % compared to initial design. Non-dimensional MTD and non-dimensional EGR are reduced by 67.9 % and 83.5 %, respectively, compared to those of a model without TSHTCC. Therefore, heat dissipation performances of stacked chip are increased.http://www.sciencedirect.com/science/article/pii/S2214157X24017659Stacked chipHeat dissipationConstructal theoryTree-shaped high-thermal-conductivity channelMaximum temperature-differenceEntropy-generation-rate |
| spellingShingle | Xuetao Xi Huijun Feng Lingen Chen Yanlin Ge A tree-shaped high thermal conductivity channel in a stacked chip with minimizing maximum temperature difference and entropy generation rate Case Studies in Thermal Engineering Stacked chip Heat dissipation Constructal theory Tree-shaped high-thermal-conductivity channel Maximum temperature-difference Entropy-generation-rate |
| title | A tree-shaped high thermal conductivity channel in a stacked chip with minimizing maximum temperature difference and entropy generation rate |
| title_full | A tree-shaped high thermal conductivity channel in a stacked chip with minimizing maximum temperature difference and entropy generation rate |
| title_fullStr | A tree-shaped high thermal conductivity channel in a stacked chip with minimizing maximum temperature difference and entropy generation rate |
| title_full_unstemmed | A tree-shaped high thermal conductivity channel in a stacked chip with minimizing maximum temperature difference and entropy generation rate |
| title_short | A tree-shaped high thermal conductivity channel in a stacked chip with minimizing maximum temperature difference and entropy generation rate |
| title_sort | tree shaped high thermal conductivity channel in a stacked chip with minimizing maximum temperature difference and entropy generation rate |
| topic | Stacked chip Heat dissipation Constructal theory Tree-shaped high-thermal-conductivity channel Maximum temperature-difference Entropy-generation-rate |
| url | http://www.sciencedirect.com/science/article/pii/S2214157X24017659 |
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