Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga–In–Sn Alloy Melt on Cu Substrate
The effect of direct current (DC) on the wetting behavior of Cu substrate by liquid Ga–25In–13Sn alloy at room temperature is investigated using a sessile drop method. It is found that there is a critical value for current intensity, below which the decrease of contact angle with increasing current...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2018-01-01
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| Series: | Advances in Condensed Matter Physics |
| Online Access: | http://dx.doi.org/10.1155/2018/6328976 |
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