Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga–In–Sn Alloy Melt on Cu Substrate
The effect of direct current (DC) on the wetting behavior of Cu substrate by liquid Ga–25In–13Sn alloy at room temperature is investigated using a sessile drop method. It is found that there is a critical value for current intensity, below which the decrease of contact angle with increasing current...
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| Format: | Article |
| Language: | English |
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Wiley
2018-01-01
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| Series: | Advances in Condensed Matter Physics |
| Online Access: | http://dx.doi.org/10.1155/2018/6328976 |
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| author | Limin Zhang Ning Li Hui Xing Rong Zhang Kaikai Song |
| author_facet | Limin Zhang Ning Li Hui Xing Rong Zhang Kaikai Song |
| author_sort | Limin Zhang |
| collection | DOAJ |
| description | The effect of direct current (DC) on the wetting behavior of Cu substrate by liquid Ga–25In–13Sn alloy at room temperature is investigated using a sessile drop method. It is found that there is a critical value for current intensity, below which the decrease of contact angle with increasing current intensity is approximately linear and above which contact angle tends to a stable value from drop shape. Current polarity is a negligible factor in the observed trend. Additionally, the observed change in contact angles is translated into the corresponding change in solid-liquid interfacial tension using the equation of state for liquid interfacial tensions. The solid-liquid interfacial tension decreases under DC. DC-induced promotion of solute diffusion coefficient is likely to play an important role in determining the wettability and solid-liquid interfacial tension under DC. |
| format | Article |
| id | doaj-art-35f865ecc80c409fbae3749921acab4d |
| institution | Kabale University |
| issn | 1687-8108 1687-8124 |
| language | English |
| publishDate | 2018-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Advances in Condensed Matter Physics |
| spelling | doaj-art-35f865ecc80c409fbae3749921acab4d2025-02-03T01:02:24ZengWileyAdvances in Condensed Matter Physics1687-81081687-81242018-01-01201810.1155/2018/63289766328976Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga–In–Sn Alloy Melt on Cu SubstrateLimin Zhang0Ning Li1Hui Xing2Rong Zhang3Kaikai Song4Shaanxi Key Laboratory of Condensed Matter Structures and Properties and Key Laboratory of Space Applied Physics and Chemistry, Ministry of Education, School of Science, Northwestern Polytechnical University, 127 West Youyi Road, Xi’an, Shaanxi 710072, ChinaShaanxi Key Laboratory of Condensed Matter Structures and Properties and Key Laboratory of Space Applied Physics and Chemistry, Ministry of Education, School of Science, Northwestern Polytechnical University, 127 West Youyi Road, Xi’an, Shaanxi 710072, ChinaShaanxi Key Laboratory of Condensed Matter Structures and Properties and Key Laboratory of Space Applied Physics and Chemistry, Ministry of Education, School of Science, Northwestern Polytechnical University, 127 West Youyi Road, Xi’an, Shaanxi 710072, ChinaShaanxi Key Laboratory of Condensed Matter Structures and Properties and Key Laboratory of Space Applied Physics and Chemistry, Ministry of Education, School of Science, Northwestern Polytechnical University, 127 West Youyi Road, Xi’an, Shaanxi 710072, ChinaSchool of Mechanical, Electrical & Information Engineering, Shandong University at Weihai, 180 Wenhua Xilu, Weihai, Shandong 264209, ChinaThe effect of direct current (DC) on the wetting behavior of Cu substrate by liquid Ga–25In–13Sn alloy at room temperature is investigated using a sessile drop method. It is found that there is a critical value for current intensity, below which the decrease of contact angle with increasing current intensity is approximately linear and above which contact angle tends to a stable value from drop shape. Current polarity is a negligible factor in the observed trend. Additionally, the observed change in contact angles is translated into the corresponding change in solid-liquid interfacial tension using the equation of state for liquid interfacial tensions. The solid-liquid interfacial tension decreases under DC. DC-induced promotion of solute diffusion coefficient is likely to play an important role in determining the wettability and solid-liquid interfacial tension under DC.http://dx.doi.org/10.1155/2018/6328976 |
| spellingShingle | Limin Zhang Ning Li Hui Xing Rong Zhang Kaikai Song Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga–In–Sn Alloy Melt on Cu Substrate Advances in Condensed Matter Physics |
| title | Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga–In–Sn Alloy Melt on Cu Substrate |
| title_full | Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga–In–Sn Alloy Melt on Cu Substrate |
| title_fullStr | Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga–In–Sn Alloy Melt on Cu Substrate |
| title_full_unstemmed | Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga–In–Sn Alloy Melt on Cu Substrate |
| title_short | Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga–In–Sn Alloy Melt on Cu Substrate |
| title_sort | effect of direct current on solid liquid interfacial tension and wetting behavior of ga in sn alloy melt on cu substrate |
| url | http://dx.doi.org/10.1155/2018/6328976 |
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