Corrigendum to “A comprehensive review of diamond-reinforced metal matrix composites for thermal management in high-performance electronics” [J Mater Res Technol Volume 33 (2024) PP. 8174-8197]

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Main Authors: Abdul Wahid Shah, Kang Wang, Jabir Ali Siddique, Wenfang Li
Format: Article
Language:English
Published: Elsevier 2025-01-01
Series:Journal of Materials Research and Technology
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785424029673
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author Abdul Wahid Shah
Kang Wang
Jabir Ali Siddique
Wenfang Li
author_facet Abdul Wahid Shah
Kang Wang
Jabir Ali Siddique
Wenfang Li
author_sort Abdul Wahid Shah
collection DOAJ
format Article
id doaj-art-35e31e95ad304bb083121e9deb2503c7
institution Kabale University
issn 2238-7854
language English
publishDate 2025-01-01
publisher Elsevier
record_format Article
series Journal of Materials Research and Technology
spelling doaj-art-35e31e95ad304bb083121e9deb2503c72025-01-19T06:25:41ZengElsevierJournal of Materials Research and Technology2238-78542025-01-01342984Corrigendum to “A comprehensive review of diamond-reinforced metal matrix composites for thermal management in high-performance electronics” [J Mater Res Technol Volume 33 (2024) PP. 8174-8197]Abdul Wahid Shah0Kang Wang1Jabir Ali Siddique2Wenfang Li3Materials Science and Engineering, Dongguan University of Technology, Dongguan, 523808, China; Mechanical and Automotive Engineering, South China University of Technology, Guangzhou, 510640, China; Corresponding author. Dongguan University of technology, Dongguan, China.Materials Science and Engineering, Dongguan University of Technology, Dongguan, 523808, ChinaIndustrial Technology, University of Science and Technology, Daejeon, 34113, South KoreaMaterials Science and Engineering, Dongguan University of Technology, Dongguan, 523808, China; Corresponding author.http://www.sciencedirect.com/science/article/pii/S2238785424029673
spellingShingle Abdul Wahid Shah
Kang Wang
Jabir Ali Siddique
Wenfang Li
Corrigendum to “A comprehensive review of diamond-reinforced metal matrix composites for thermal management in high-performance electronics” [J Mater Res Technol Volume 33 (2024) PP. 8174-8197]
Journal of Materials Research and Technology
title Corrigendum to “A comprehensive review of diamond-reinforced metal matrix composites for thermal management in high-performance electronics” [J Mater Res Technol Volume 33 (2024) PP. 8174-8197]
title_full Corrigendum to “A comprehensive review of diamond-reinforced metal matrix composites for thermal management in high-performance electronics” [J Mater Res Technol Volume 33 (2024) PP. 8174-8197]
title_fullStr Corrigendum to “A comprehensive review of diamond-reinforced metal matrix composites for thermal management in high-performance electronics” [J Mater Res Technol Volume 33 (2024) PP. 8174-8197]
title_full_unstemmed Corrigendum to “A comprehensive review of diamond-reinforced metal matrix composites for thermal management in high-performance electronics” [J Mater Res Technol Volume 33 (2024) PP. 8174-8197]
title_short Corrigendum to “A comprehensive review of diamond-reinforced metal matrix composites for thermal management in high-performance electronics” [J Mater Res Technol Volume 33 (2024) PP. 8174-8197]
title_sort corrigendum to a comprehensive review of diamond reinforced metal matrix composites for thermal management in high performance electronics j mater res technol volume 33 2024 pp 8174 8197
url http://www.sciencedirect.com/science/article/pii/S2238785424029673
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