Corrigendum to “A comprehensive review of diamond-reinforced metal matrix composites for thermal management in high-performance electronics” [J Mater Res Technol Volume 33 (2024) PP. 8174-8197]
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Format: | Article |
Language: | English |
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Elsevier
2025-01-01
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Series: | Journal of Materials Research and Technology |
Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424029673 |
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author | Abdul Wahid Shah Kang Wang Jabir Ali Siddique Wenfang Li |
author_facet | Abdul Wahid Shah Kang Wang Jabir Ali Siddique Wenfang Li |
author_sort | Abdul Wahid Shah |
collection | DOAJ |
format | Article |
id | doaj-art-35e31e95ad304bb083121e9deb2503c7 |
institution | Kabale University |
issn | 2238-7854 |
language | English |
publishDate | 2025-01-01 |
publisher | Elsevier |
record_format | Article |
series | Journal of Materials Research and Technology |
spelling | doaj-art-35e31e95ad304bb083121e9deb2503c72025-01-19T06:25:41ZengElsevierJournal of Materials Research and Technology2238-78542025-01-01342984Corrigendum to “A comprehensive review of diamond-reinforced metal matrix composites for thermal management in high-performance electronics” [J Mater Res Technol Volume 33 (2024) PP. 8174-8197]Abdul Wahid Shah0Kang Wang1Jabir Ali Siddique2Wenfang Li3Materials Science and Engineering, Dongguan University of Technology, Dongguan, 523808, China; Mechanical and Automotive Engineering, South China University of Technology, Guangzhou, 510640, China; Corresponding author. Dongguan University of technology, Dongguan, China.Materials Science and Engineering, Dongguan University of Technology, Dongguan, 523808, ChinaIndustrial Technology, University of Science and Technology, Daejeon, 34113, South KoreaMaterials Science and Engineering, Dongguan University of Technology, Dongguan, 523808, China; Corresponding author.http://www.sciencedirect.com/science/article/pii/S2238785424029673 |
spellingShingle | Abdul Wahid Shah Kang Wang Jabir Ali Siddique Wenfang Li Corrigendum to “A comprehensive review of diamond-reinforced metal matrix composites for thermal management in high-performance electronics” [J Mater Res Technol Volume 33 (2024) PP. 8174-8197] Journal of Materials Research and Technology |
title | Corrigendum to “A comprehensive review of diamond-reinforced metal matrix composites for thermal management in high-performance electronics” [J Mater Res Technol Volume 33 (2024) PP. 8174-8197] |
title_full | Corrigendum to “A comprehensive review of diamond-reinforced metal matrix composites for thermal management in high-performance electronics” [J Mater Res Technol Volume 33 (2024) PP. 8174-8197] |
title_fullStr | Corrigendum to “A comprehensive review of diamond-reinforced metal matrix composites for thermal management in high-performance electronics” [J Mater Res Technol Volume 33 (2024) PP. 8174-8197] |
title_full_unstemmed | Corrigendum to “A comprehensive review of diamond-reinforced metal matrix composites for thermal management in high-performance electronics” [J Mater Res Technol Volume 33 (2024) PP. 8174-8197] |
title_short | Corrigendum to “A comprehensive review of diamond-reinforced metal matrix composites for thermal management in high-performance electronics” [J Mater Res Technol Volume 33 (2024) PP. 8174-8197] |
title_sort | corrigendum to a comprehensive review of diamond reinforced metal matrix composites for thermal management in high performance electronics j mater res technol volume 33 2024 pp 8174 8197 |
url | http://www.sciencedirect.com/science/article/pii/S2238785424029673 |
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