Interfacial reaction and thermomigration of copper/indium joints
Indium is a promising joining material for low-temperature soldering and thermal interface applications. Copper is a common metal pad used to join indium to form solder joints. Interfacial reactions and thermomigration are two important research subjects for the reliability assessment of solder join...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-01-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424030308 |
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