Solid State Metal-Ceramic Reaction Bonding Applications to Transistor Packages and Advanced Materials

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Bibliographic Details
Main Author: R. V. Allen
Format: Article
Language:English
Published: Wiley 1983-01-01
Series:Active and Passive Electronic Components
Online Access:http://dx.doi.org/10.1155/APEC.11.85
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author R. V. Allen
author_facet R. V. Allen
author_sort R. V. Allen
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institution Kabale University
issn 0882-7516
1563-5031
language English
publishDate 1983-01-01
publisher Wiley
record_format Article
series Active and Passive Electronic Components
spelling doaj-art-32c40b416fa2444588cc005db9ef7a932025-02-03T06:12:46ZengWileyActive and Passive Electronic Components0882-75161563-50311983-01-01111858710.1155/APEC.11.85Solid State Metal-Ceramic Reaction Bonding Applications to Transistor Packages and Advanced MaterialsR. V. Allenhttp://dx.doi.org/10.1155/APEC.11.85
spellingShingle R. V. Allen
Solid State Metal-Ceramic Reaction Bonding Applications to Transistor Packages and Advanced Materials
Active and Passive Electronic Components
title Solid State Metal-Ceramic Reaction Bonding Applications to Transistor Packages and Advanced Materials
title_full Solid State Metal-Ceramic Reaction Bonding Applications to Transistor Packages and Advanced Materials
title_fullStr Solid State Metal-Ceramic Reaction Bonding Applications to Transistor Packages and Advanced Materials
title_full_unstemmed Solid State Metal-Ceramic Reaction Bonding Applications to Transistor Packages and Advanced Materials
title_short Solid State Metal-Ceramic Reaction Bonding Applications to Transistor Packages and Advanced Materials
title_sort solid state metal ceramic reaction bonding applications to transistor packages and advanced materials
url http://dx.doi.org/10.1155/APEC.11.85
work_keys_str_mv AT rvallen solidstatemetalceramicreactionbondingapplicationstotransistorpackagesandadvancedmaterials