Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu Bonding Application
This study investigates the optimization of O2 plasma treatment conditions to enhance Cu-Cu bonding. The O2 plasma treatment conditions were optimized using Design of Experiments (DOE), adjusting three parameters: O2 flow rate, plasma power, and treatment time, to minimize oxidation while maximizing...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2025-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10854209/ |
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