Assembly of Fine-Pitch Package Integrated Circuits in a Laminated Transfer Process for E-Textile Applications
Laminating screen-printed, flexible transfers is a reliable method of creating electronic connections across a textile. However, their limited resolution means that it is not possible to solder on fine-pitched components. An alternative substrate, etched copper on polyimide is compatible with fine p...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-02-01
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| Series: | Engineering Proceedings |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2673-4591/52/1/27 |
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