APA (7th ed.) Citation

Li, Y., Greig, T., Komolafe, A., Torah, R., & Beeby, S. Assembly of Fine-Pitch Package Integrated Circuits in a Laminated Transfer Process for E-Textile Applications. MDPI AG.

Chicago Style (17th ed.) Citation

Li, Yi, Thomas Greig, Abiodun Komolafe, Russel Torah, and Steve Beeby. Assembly of Fine-Pitch Package Integrated Circuits in a Laminated Transfer Process for E-Textile Applications. MDPI AG.

MLA (9th ed.) Citation

Li, Yi, et al. Assembly of Fine-Pitch Package Integrated Circuits in a Laminated Transfer Process for E-Textile Applications. MDPI AG.