Thermal Characteristics of InGaN/GaN Flip-Chip Light Emitting Diodes with Diamond-Like Carbon Heat-Spreading Layers
The temperature-dependent optical, electrical, and thermal properties of flip-chip light emitting diodes (FCLEDs) with diamond-like carbon (DLC) heat-spreading layers were investigated. On the basis of the measured results in the 20°C to 100°C temperature range, a significant performance improvement...
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| Format: | Article |
| Language: | English |
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Wiley
2014-01-01
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| Series: | International Journal of Photoenergy |
| Online Access: | http://dx.doi.org/10.1155/2014/829284 |
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| author | Pai-Yang Tsai Hou-Kuei Huang Chien-Min Sung Ming-Chi Kan Yeong-Her Wang |
| author_facet | Pai-Yang Tsai Hou-Kuei Huang Chien-Min Sung Ming-Chi Kan Yeong-Her Wang |
| author_sort | Pai-Yang Tsai |
| collection | DOAJ |
| description | The temperature-dependent optical, electrical, and thermal properties of flip-chip light emitting diodes (FCLEDs) with diamond-like carbon (DLC) heat-spreading layers were investigated. On the basis of the measured results in the 20°C to 100°C temperature range, a significant performance improvement can be achieved for FCLEDs with DLC heat-spreading layers (DLC-FCLED) compared with FCLEDs without DLC heat-spreading layers (non-DLC-FCLED). The external quantum efficiency (EQE) of the DLC-FCLED improves by 9% at an injection current of 1000 mA and a temperature of 100°C. The forward voltage and spectra variations are smaller than those of non-DLC-FCLEDs. The DLC-FCLED provides high efficiency and high stability performance for high-power and high-temperature applications. |
| format | Article |
| id | doaj-art-2c01fd99fe0f49579d9399ba77af0da7 |
| institution | Kabale University |
| issn | 1110-662X 1687-529X |
| language | English |
| publishDate | 2014-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | International Journal of Photoenergy |
| spelling | doaj-art-2c01fd99fe0f49579d9399ba77af0da72025-02-03T01:31:31ZengWileyInternational Journal of Photoenergy1110-662X1687-529X2014-01-01201410.1155/2014/829284829284Thermal Characteristics of InGaN/GaN Flip-Chip Light Emitting Diodes with Diamond-Like Carbon Heat-Spreading LayersPai-Yang Tsai0Hou-Kuei Huang1Chien-Min Sung2Ming-Chi Kan3Yeong-Her Wang4Institute of Microelectronics, Department of Electrical Engineering, Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 701, TaiwanInstitute of Microelectronics, Department of Electrical Engineering, Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 701, TaiwanDepartment of DLC Technology, RiteDia, Hsin Chu 303, TaiwanDepartment of DLC Technology, RiteDia, Hsin Chu 303, TaiwanInstitute of Microelectronics, Department of Electrical Engineering, Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 701, TaiwanThe temperature-dependent optical, electrical, and thermal properties of flip-chip light emitting diodes (FCLEDs) with diamond-like carbon (DLC) heat-spreading layers were investigated. On the basis of the measured results in the 20°C to 100°C temperature range, a significant performance improvement can be achieved for FCLEDs with DLC heat-spreading layers (DLC-FCLED) compared with FCLEDs without DLC heat-spreading layers (non-DLC-FCLED). The external quantum efficiency (EQE) of the DLC-FCLED improves by 9% at an injection current of 1000 mA and a temperature of 100°C. The forward voltage and spectra variations are smaller than those of non-DLC-FCLEDs. The DLC-FCLED provides high efficiency and high stability performance for high-power and high-temperature applications.http://dx.doi.org/10.1155/2014/829284 |
| spellingShingle | Pai-Yang Tsai Hou-Kuei Huang Chien-Min Sung Ming-Chi Kan Yeong-Her Wang Thermal Characteristics of InGaN/GaN Flip-Chip Light Emitting Diodes with Diamond-Like Carbon Heat-Spreading Layers International Journal of Photoenergy |
| title | Thermal Characteristics of InGaN/GaN Flip-Chip Light Emitting Diodes with Diamond-Like Carbon Heat-Spreading Layers |
| title_full | Thermal Characteristics of InGaN/GaN Flip-Chip Light Emitting Diodes with Diamond-Like Carbon Heat-Spreading Layers |
| title_fullStr | Thermal Characteristics of InGaN/GaN Flip-Chip Light Emitting Diodes with Diamond-Like Carbon Heat-Spreading Layers |
| title_full_unstemmed | Thermal Characteristics of InGaN/GaN Flip-Chip Light Emitting Diodes with Diamond-Like Carbon Heat-Spreading Layers |
| title_short | Thermal Characteristics of InGaN/GaN Flip-Chip Light Emitting Diodes with Diamond-Like Carbon Heat-Spreading Layers |
| title_sort | thermal characteristics of ingan gan flip chip light emitting diodes with diamond like carbon heat spreading layers |
| url | http://dx.doi.org/10.1155/2014/829284 |
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