Investigation of thermal transport across volume-controlled thermal interface materials
For thermal management, thermal interface materials are essential to reduce parasitic thermal resistance by filling microscopic gaps at interface. While much of previous research has focused on enhancing the thermal conductivity of the materials, the inconsistency in experimental data limits fundame...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-05-01
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| Series: | Polymer Testing |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S0142941825000947 |
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| _version_ | 1849729789689069568 |
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| author | Jungmin Lee Woosung Park |
| author_facet | Jungmin Lee Woosung Park |
| author_sort | Jungmin Lee |
| collection | DOAJ |
| description | For thermal management, thermal interface materials are essential to reduce parasitic thermal resistance by filling microscopic gaps at interface. While much of previous research has focused on enhancing the thermal conductivity of the materials, the inconsistency in experimental data limits fundamental investigation in the thermal interface materials. In this work, we use a screen printing and pressing method to apply thermal interface material in a consistent manner, enabling fundamental investigation to identify an optimal bond line thickness for thermal interface material. Specifically, we apply two-dimensional array of cylindrical pillars and modulate its diameter and pitch to find an optimal volume experimentally. The thermal resistance is measured using a standard thermal interface test method, and an optimal volume of thermal interface material is experimentally determined. We apply a rheological model for the thermal interface material to estimate the optimal bond line thickness under pressure, and the model prediction agrees with experimental data within ∼89.4 %. This work establishes an experimental methodology for thermal interface material, bridging a gap between its theoretical and practical approaches. |
| format | Article |
| id | doaj-art-29efdeaca76a4fd897b80c8ddff4e1c8 |
| institution | DOAJ |
| issn | 1873-2348 |
| language | English |
| publishDate | 2025-05-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Polymer Testing |
| spelling | doaj-art-29efdeaca76a4fd897b80c8ddff4e1c82025-08-20T03:09:04ZengElsevierPolymer Testing1873-23482025-05-0114610878010.1016/j.polymertesting.2025.108780Investigation of thermal transport across volume-controlled thermal interface materialsJungmin Lee0Woosung Park1School of Mechanical Engineering, Purdue University, West Lafeyette, IN, 47907, United StatesSchool of Mechanical Engineering, Hanyang University, Seoul, 04763, South Korea; Corresponding author.For thermal management, thermal interface materials are essential to reduce parasitic thermal resistance by filling microscopic gaps at interface. While much of previous research has focused on enhancing the thermal conductivity of the materials, the inconsistency in experimental data limits fundamental investigation in the thermal interface materials. In this work, we use a screen printing and pressing method to apply thermal interface material in a consistent manner, enabling fundamental investigation to identify an optimal bond line thickness for thermal interface material. Specifically, we apply two-dimensional array of cylindrical pillars and modulate its diameter and pitch to find an optimal volume experimentally. The thermal resistance is measured using a standard thermal interface test method, and an optimal volume of thermal interface material is experimentally determined. We apply a rheological model for the thermal interface material to estimate the optimal bond line thickness under pressure, and the model prediction agrees with experimental data within ∼89.4 %. This work establishes an experimental methodology for thermal interface material, bridging a gap between its theoretical and practical approaches.http://www.sciencedirect.com/science/article/pii/S0142941825000947Thermal interface materialThermal contact resistanceRheologyHeat conduction |
| spellingShingle | Jungmin Lee Woosung Park Investigation of thermal transport across volume-controlled thermal interface materials Polymer Testing Thermal interface material Thermal contact resistance Rheology Heat conduction |
| title | Investigation of thermal transport across volume-controlled thermal interface materials |
| title_full | Investigation of thermal transport across volume-controlled thermal interface materials |
| title_fullStr | Investigation of thermal transport across volume-controlled thermal interface materials |
| title_full_unstemmed | Investigation of thermal transport across volume-controlled thermal interface materials |
| title_short | Investigation of thermal transport across volume-controlled thermal interface materials |
| title_sort | investigation of thermal transport across volume controlled thermal interface materials |
| topic | Thermal interface material Thermal contact resistance Rheology Heat conduction |
| url | http://www.sciencedirect.com/science/article/pii/S0142941825000947 |
| work_keys_str_mv | AT jungminlee investigationofthermaltransportacrossvolumecontrolledthermalinterfacematerials AT woosungpark investigationofthermaltransportacrossvolumecontrolledthermalinterfacematerials |