Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic Methods
This study evaluates IGBT modules with a focus on efficiently measuring their thermal impedance, a critical factor in reliability assessments. The research employs the Thermo Electric Sensitive Parameter method to measure the Virtual Junction Temperature and obtain the Thermal Impedance curve. Thes...
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Format: | Article |
Language: | English |
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Associação Brasileira de Eletrônica de Potência
2025-01-01
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Series: | Eletrônica de Potência |
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Online Access: | https://journal.sobraep.org.br/index.php/rep/article/view/995 |
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author | Deivid F. de Souza Diego S. Greff |
author_facet | Deivid F. de Souza Diego S. Greff |
author_sort | Deivid F. de Souza |
collection | DOAJ |
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This study evaluates IGBT modules with a focus on efficiently measuring their thermal impedance, a critical factor in reliability assessments. The research employs the Thermo Electric Sensitive Parameter method to measure the Virtual Junction Temperature and obtain the Thermal Impedance curve. These experimental results are compared with datasheet values, using power modules without a baseplate. Two methodologies, dynamic and static, are utilized, both demonstrating consistent performance in evaluating thermal characteristics. The study also addresses the importance of accounting for non-linearity in thermal conductance due to temperature dependency, which is essential for accurate thermal characterization. Additionally, it explores the potential for measuring the Thermal Impedance between Junction and Case in power modules without a baseplate, offering a comprehensive understanding of thermal performance.
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format | Article |
id | doaj-art-29d3c0511cd14631a490c0e5f4f9d11e |
institution | Kabale University |
issn | 1414-8862 1984-557X |
language | English |
publishDate | 2025-01-01 |
publisher | Associação Brasileira de Eletrônica de Potência |
record_format | Article |
series | Eletrônica de Potência |
spelling | doaj-art-29d3c0511cd14631a490c0e5f4f9d11e2025-01-22T19:05:21ZengAssociação Brasileira de Eletrônica de PotênciaEletrônica de Potência1414-88621984-557X2025-01-013010.18618/REP.e202510Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic MethodsDeivid F. de Souza 0https://orcid.org/0009-0000-8322-8913Diego S. Greff1https://orcid.org/0000-0002-0596-6790Universidade Federal de Santa Catarina Universidade Federal de Santa Catarina This study evaluates IGBT modules with a focus on efficiently measuring their thermal impedance, a critical factor in reliability assessments. The research employs the Thermo Electric Sensitive Parameter method to measure the Virtual Junction Temperature and obtain the Thermal Impedance curve. These experimental results are compared with datasheet values, using power modules without a baseplate. Two methodologies, dynamic and static, are utilized, both demonstrating consistent performance in evaluating thermal characteristics. The study also addresses the importance of accounting for non-linearity in thermal conductance due to temperature dependency, which is essential for accurate thermal characterization. Additionally, it explores the potential for measuring the Thermal Impedance between Junction and Case in power modules without a baseplate, offering a comprehensive understanding of thermal performance. https://journal.sobraep.org.br/index.php/rep/article/view/995Thermal Impedance CharacterizationIGBT Module ReliabilityVirtual Junction Temperature MeasurementThermoelectric Characterization |
spellingShingle | Deivid F. de Souza Diego S. Greff Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic Methods Eletrônica de Potência Thermal Impedance Characterization IGBT Module Reliability Virtual Junction Temperature Measurement Thermoelectric Characterization |
title | Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic Methods |
title_full | Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic Methods |
title_fullStr | Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic Methods |
title_full_unstemmed | Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic Methods |
title_short | Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic Methods |
title_sort | thermoelectric characterization of igbt power modules an approach by static and dynamic methods |
topic | Thermal Impedance Characterization IGBT Module Reliability Virtual Junction Temperature Measurement Thermoelectric Characterization |
url | https://journal.sobraep.org.br/index.php/rep/article/view/995 |
work_keys_str_mv | AT deividfdesouza thermoelectriccharacterizationofigbtpowermodulesanapproachbystaticanddynamicmethods AT diegosgreff thermoelectriccharacterizationofigbtpowermodulesanapproachbystaticanddynamicmethods |