Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic Methods

This study evaluates IGBT modules with a focus on efficiently measuring their thermal impedance, a critical factor in reliability assessments. The research employs the Thermo Electric Sensitive Parameter method to measure the Virtual Junction Temperature and obtain the Thermal Impedance curve. Thes...

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Main Authors: Deivid F. de Souza, Diego S. Greff
Format: Article
Language:English
Published: Associação Brasileira de Eletrônica de Potência 2025-01-01
Series:Eletrônica de Potência
Subjects:
Online Access:https://journal.sobraep.org.br/index.php/rep/article/view/995
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author Deivid F. de Souza
Diego S. Greff
author_facet Deivid F. de Souza
Diego S. Greff
author_sort Deivid F. de Souza
collection DOAJ
description This study evaluates IGBT modules with a focus on efficiently measuring their thermal impedance, a critical factor in reliability assessments. The research employs the Thermo Electric Sensitive Parameter method to measure the Virtual Junction Temperature and obtain the Thermal Impedance curve. These experimental results are compared with datasheet values, using power modules without a baseplate. Two methodologies, dynamic and static, are utilized, both demonstrating consistent performance in evaluating thermal characteristics. The study also addresses the importance of accounting for non-linearity in thermal conductance due to temperature dependency, which is essential for accurate thermal characterization. Additionally, it explores the potential for measuring the Thermal Impedance between Junction and Case in power modules without a baseplate, offering a comprehensive understanding of thermal performance.
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id doaj-art-29d3c0511cd14631a490c0e5f4f9d11e
institution Kabale University
issn 1414-8862
1984-557X
language English
publishDate 2025-01-01
publisher Associação Brasileira de Eletrônica de Potência
record_format Article
series Eletrônica de Potência
spelling doaj-art-29d3c0511cd14631a490c0e5f4f9d11e2025-01-22T19:05:21ZengAssociação Brasileira de Eletrônica de PotênciaEletrônica de Potência1414-88621984-557X2025-01-013010.18618/REP.e202510Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic MethodsDeivid F. de Souza 0https://orcid.org/0009-0000-8322-8913Diego S. Greff1https://orcid.org/0000-0002-0596-6790Universidade Federal de Santa Catarina Universidade Federal de Santa Catarina This study evaluates IGBT modules with a focus on efficiently measuring their thermal impedance, a critical factor in reliability assessments. The research employs the Thermo Electric Sensitive Parameter method to measure the Virtual Junction Temperature and obtain the Thermal Impedance curve. These experimental results are compared with datasheet values, using power modules without a baseplate. Two methodologies, dynamic and static, are utilized, both demonstrating consistent performance in evaluating thermal characteristics. The study also addresses the importance of accounting for non-linearity in thermal conductance due to temperature dependency, which is essential for accurate thermal characterization. Additionally, it explores the potential for measuring the Thermal Impedance between Junction and Case in power modules without a baseplate, offering a comprehensive understanding of thermal performance. https://journal.sobraep.org.br/index.php/rep/article/view/995Thermal Impedance CharacterizationIGBT Module ReliabilityVirtual Junction Temperature MeasurementThermoelectric Characterization
spellingShingle Deivid F. de Souza
Diego S. Greff
Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic Methods
Eletrônica de Potência
Thermal Impedance Characterization
IGBT Module Reliability
Virtual Junction Temperature Measurement
Thermoelectric Characterization
title Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic Methods
title_full Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic Methods
title_fullStr Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic Methods
title_full_unstemmed Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic Methods
title_short Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic Methods
title_sort thermoelectric characterization of igbt power modules an approach by static and dynamic methods
topic Thermal Impedance Characterization
IGBT Module Reliability
Virtual Junction Temperature Measurement
Thermoelectric Characterization
url https://journal.sobraep.org.br/index.php/rep/article/view/995
work_keys_str_mv AT deividfdesouza thermoelectriccharacterizationofigbtpowermodulesanapproachbystaticanddynamicmethods
AT diegosgreff thermoelectriccharacterizationofigbtpowermodulesanapproachbystaticanddynamicmethods