Reliability Considerations of Flip Chip Components for Automotive Electronic Applications

Reliability Considerations of Flip Chip Components for Automotive Electronic Applications

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Bibliographic Details
Main Authors:	Iwao Tachikawa, Naoharu Tsuzimoto, Isao Bansaku, Keisuke Sugiyama
Format:	Article
Language:	English
Published:	Wiley 1981-01-01
Series:	Active and Passive Electronic Components
Online Access:	http://dx.doi.org/10.1155/APEC.9.87
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